Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectors

Chen, Long; Preston, Kyle; Manipatruni, Sasikanth; Lipson, Michal

doi:10.1364/oe.17.015248

Cited by 179 publications

(117 citation statements)

References 34 publications

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“…Consequently, similar performance requirements rise for switching and routing functionalities leading to the replacements of electronics by optical components for signal processing [4][5][6]. Examples of integrated photonic solutions are demonstrated in microwave photonics (MWP) [7,8], network components for fiber-to-the-home (FTTH) [9,10], and datacom applications [11][12][13]. For compatibility with the existing fiber backbone, Telecom and FTTH applications require wavelength ranges at 1.3-1.55 μm, while for datacom applications, the availability of low-cost, high-speed modulating VCSELs is of importance.…”

Section: Introductionmentioning

confidence: 99%

TriPleX: a versatile dielectric photonic platform

Wörhoff

Heideman

Leinse

et al. 2015

Advanced Optical Technologies

207

175

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Photonic applications based on planar waveguide technology impose stringent requirements on properties such as optical propagation losses, light coupling to optical fibers, integration density, as well as on reliability and reproducibility. The latter is correlated to a high level of control of the refractive index and waveguide geometry. In this paper, we review a versatile dielectric waveguide platform, called TriPleX, which is based on alternating silicon nitride and silicon dioxide films. Fabrication with CMOS-compatible equipment based on low-pressure chemical vapor deposition enables the realization of stable material compositions being a prerequisite to the control of waveguide properties and modal shape. The transparency window of both materials allows for the realization of low-loss waveguides over a wide wavelength range (400 nm-2.35 μm). Propagation losses as low as 5 × 10 -4 dB/cm are reported. Three basic geometries (box shell, double stripe, and filled box) can be distinguished. A specific tapering technology is developed for on-chip, low-loss ( < 0.1 dB) spotsize convertors, allowing for combining efficient fiber to chip coupling with high-contrast waveguides required for increased functional complexity as well as for hybrid integration with other photonic platforms such as InP and SOI. The functionality of the TriPleX platform is captured by verified basic building blocks. The corresponding library and associated design kit is available for multi-project wafer (MPW) runs. Several applications of this platform technology in communications, biomedicine, sensing, as well as a few special fields of photonics are treated in more detail.

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Section: Introductionmentioning

confidence: 99%

TriPleX: a versatile dielectric photonic platform

Wörhoff

Heideman

Leinse

et al. 2015

Advanced Optical Technologies

207

175

View full text Add to dashboard Cite

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“…This can be achieved by using e.g. silicon modulators and germanium detectors [6]. However, these modulators have generally high insertion loss.…”

Section: Introductionmentioning

confidence: 99%

Realization of a Compact Optical Interconnect on Silicon by Heterogeneous Integration of III–V

Spuesens

Bauwelinck

Régrény

et al. 2013

IEEE Photon. Technol. Lett.

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Abstract-We present a compact optical interconnect on a silicon-on-insulator platform consisting of a directly modulated microdisk laser and detector connected via a silicon waveguide. A single III-V epitaxial structure that contains layers for both the laser and detector ensures that dense integration becomes possible. All fabrication steps for the laser and detector, except for the detector mesa, are carried out simultaneously. The microdisk laser has a threshold current of 0.45 mA and a slope efficiency of 57 µW/mA. The responsivity of the detectors is 0.69 A/W. The full optical link has a static efficiency of 3% and a bandwidth of 7.6 GHz. A large signal modulation was applied and a 10 Gb/s bit pattern could be resolved.Index Terms-Heterogeneous integration, microdisk laser (MDL), optical interconnect, photonic integration, silicon photonics, waveguide photodetector.

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“…Further, with the growing use of high data rate serial links, the SerDes power consumption will continue to decrease [32]. We envision huge power savings by incorporating integrated photonic components [33] in future OCM nodes, gaining benefits from the tighter integration of optical components with electronic driver and receiver circuitry [13][14][15]. Silicon photonics will eliminate the need for any off-chip wiring, such as between an SDRAM chip and a transceiver, improving the overall bandwidth, latency, and energy efficiency.…”

Section: E Architectural Analysis and Discussionmentioning

confidence: 99%

Building Data Centers With Optically Connected Memory

Brunina¹,

Lai

Garg

et al. 2011

J. Opt. Commun. Netw.

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Abstract-Future data centers will require novel, scalable memory architectures capable of sustaining high bandwidths while still achieving low memory access latencies. Electronic interconnects cannot meet the challenges presented by the need for multi-terabit off-chip memory data paths. In this work, the electronic bus between main memory and its host processor is replaced with a circuit-switched optical interconnection network. We investigate the impact of our optically connected memory system on large-scale architectures and experimentally validate the protocol using field-programmable gate array based processor nodes and a custom-designed memory controller. The processor communicates all-optically with multiple synchronous dynamic random access memory nodes using 4×2.5-Gb/s wavelength-striped payloads, operating error free with bit-error rates less than 10 −12 .

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Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectors

Cited by 179 publications

References 34 publications

TriPleX: a versatile dielectric photonic platform

TriPleX: a versatile dielectric photonic platform

Realization of a Compact Optical Interconnect on Silicon by Heterogeneous Integration of III–V

Building Data Centers With Optically Connected Memory

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