Integrated CMOS-MEMS Technology and Its Applications

Abstract

The paper reports a feature and techniques to resolve requirements of integrated CMOS-MEMS technology. The multiphysics simulation platform for this technology has been developed to understand simultaneously both the mechanical and electrical behaviors of MEMS stacked on LSI. An equivalent circuit of a MEMS accelerometer has been developed with an electrical circuit simulator. We review the technology for CMOS-MEMS accelerometer with a wide detection range. Using the simulation platform above, we investigated the capacitive CMOS-MEMS sensor to a MEMS accelerometer implemented by the post-CMOS process onto CMOS circuit. As a result, it is confirmed that integrated CMOS-MEMS technology will shed light on a solution of More than Moore technical trends.

Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer

“…6. (8)(9)(10) When acceleration is applied to the MEMS accelerometer, C s is changed. C p is capacitance in the SiO 2 film.…”

“…(5)(6)(7) Thus, our group has developed MEMS accelerometers with sensing resolutions higher than 1 G (1 G = 9.8 m/s 2 ). (8)(9)(10) The performance of MEMS accelerometers is affected by noise, including the Brownian noise B n . (11)(12)(13)(14) In practical use, the sensing resolution of MEMS accelerometers is evaluated using vibration exciters.…”

“…Although methods with rotation motors have been used in practice for the evaluation of MEMS inclinometers, (19)(20)(21)(22) microgravity acceleration cannot be applied to such methods; thus, we have developed a MEMS inclinometer fabricated with the multilayer-metal technology (23) and a tilting-board method to evaluate the MEMS inclinometer. (24) In this study, we investigated the possibility of generating microgravity acceleration and evaluating the sensing resolution of the developed sub-1-mG MEMS accelerometer (8)(9)(10) by the tilting-board method. First, we describe the approach for generating microgravity acceleration using a tilting board.…”

Brittle Fracture of Electrodeposited Gold Observed by Micro-Compression

“…These properties make gold promising materials to be used as structure materials in micro-electro-mechanical systems (MEMS) devices. Yamane et al reported that the sensitivity of MEMS accelerometers using gold-based components would be higher when compared with the conventional silicon-based components [1][2][3] . The high sensitivity is mostly contributed by the much higher density of gold (19.30 g/cm 3 at 298 K) than silicon (2.33 g/ cm 3 at 298 K).…”

Study on Ti/Au Two-Layered Cantilevers with Different Aspect Ratio for MEMS Devices

“…After the seed layer formation, lithography process and electroplating are carried out. More details can be found in the previous study [5]. The micro-cantilevers were fabricated on a SiO 2 layer.…”