Insulating polymer nanocomposites with high-thermal-conduction routes via linear densely packed boron nitride nanosheets

A review of thermoplastic elastomeric nanocomposites for high voltage insulation applications

“…Investigations also have been extended on the life expectancy and aging of the polymeric housings which are influenced by many factors such as electric stress and its distribution, moisture ingress, oxidation, biological attacks, presence of contaminations, mechanical and thermal stresses, and so on . Other research works regarding the housing materials such as how different material additives like fillers and nanofillers influence the performance of the insulators are also intensively conducted .…”

“…Boron nitride (BN) offers advantageous thermal conductivity and electrical insulation compared to the other inorganic fillers. BN is suitable as filler for highly thermal conductive composite insulator as it has an excellent conduction of heat, comparable to aluminum nitride, and it exhibits thermal conductivities that are among the highest of all electrical insulators . In addition, BN has high electrical resistivity, low dielectric constant, excellent high temperature resistance and low density.…”

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

“…The high directionality in the in-plane and through-plane of AlN/GNP composites, 74 W/mK for in-plane and 37 W/mK for through-plane, is ascribed to the thermal contact resistance existing in both phase interfaces that are severe in the perpendicular heat transfer direction of graphene nanoplatelets [7]. This strong directionality in heat transfer, thermal conductivity, can be easily found in the boron nitride (BN)/polymer composite system, in which 2D morphology BN filler materials are used [9][10][11][12][13][14][15][16]. In case of reduced graphene oxide (rGO) added AlN, the thermal conductivity decreased sharply from 92.5 to 37.4 W/mK when 2 wt% of rGO was added, though there are minor increases in flexural strength and fracture toughness at ≤1 wt% of rGO, which is due to the low crystallinity, high vacancy defects in rGO, and increased interfacial thermal resistance [8].…”

“…In the hexagonal-boron nitride (h-BN) filled polymer composites, the major issues to enhance heat transfer property are surface treatment of h-BN platelet particles to improve the dispersion of the filler particles in the polymer matrix; to lower the interface thermal resistance; and to increase the alignment of h-BN particles to the preferred orientation in order to achieve high directional thermal conductivity in composites. Table 5 summarizes several technical efforts to enhance the heat transfer properties of polymer-BN composites [13][14][15][16][21][22][23][24].…”

Effect of electron beam irradiation on dielectric properties, morphology and melt rheology of linear low density polyethylene/silicone rubber‐based thermoplastic elastomer nanocomposites

“…BN fillers are dielectric ceramic particles with a wide band gap of 6 eV. They have high thermal conductivity, excellent thermal and chemical stability, as well as desirably low dielectric permittivity and loss . BN‐based nanocomposites have great potential for application in HV electrical insulators as they are reported to possess not only high insulating properties, but also good thermal conduction to effectively dissipate the heat generated within the insulator, thus preventing thermal runaway .…”