Insulated signal transfer in a half bridge driver IC based on coreless transformer technology

Comparison of different device concepts to increase the operating voltage of a trench isolated SOI technology to above 900V

“…The area required for high voltage integrated devices is huge because of the isolation requirements and the peak power requirements in the moment of signal transmission and transients. The inductive shifter [7] overcomes the problems of transients and can be used for higher DC-Link voltages, but the area required for the integrated air coils is even higher than the area of integrated high voltage devices. Therefore some manufacturers stack the transformer on top of the driver or receiver die.…”

Integrated coreless transformer for high temperatures design and evaluation

“…Engineers and scientists have produced a huge variety of solutions ranging from transformers to optical systems links. Recently coreless transformers have gained popularity as it is now possible to integrate them with driver integrated circuits, [4,5,1]. For some applications especially or when full integration is not practical, it could be advantageous to have a discrete integrated coreless component.…”

“…Coreless transformer for insulating control signals in a power converter at high temperatures Recent advances have brought to industrial level the coreless technology for the insulation of control signals in an integrated driver chip [4]. However, there is an interest to develop a discrete coreless transformer.…”

Analysis on a single-layer winding array structure for contactless battery charging systems with free-positioning and localized charging features

“…Instead of the parallel-flux approach [19,20], the "vertical-flux" approach [20][21][22][23][24] is endorsed in the Qi version 1.0 standard because it can utilize the entire charging surface for energy transfer and has no restriction on the orientation of the receiver coil. Originated from the coreless planar transformer technology [2][3][4][5][6][7]17,20] in which energy is transferred from the planar primary winding printed on one side of the printed circuit board (PCB) 'vertically' to the secondary winding printed on the other side of the PCB, the vertical-flux idea has been successfully demonstrated in isolated gate-drive circuit [4,5] and later implemented in integrated circuits [11,12], planar power converters [6], wirelessly powering a lighting device by Philips Research [10] and charging a mobile phone in a 'fixed-positioning' manner [7]. By extending the planar winding into a multilayer winding array structure [8,23] and selectively activating the appropriate coils for localized charging [9,24], the Approach 3 (Fig.1c).…”