Insulated Cu wire free air ball characterization

Leong, Hungyang; Yap, Boon Kar; Khan, N.; Ibrahim, Mohd Rusli; Tan, L.C.

doi:10.1016/j.microrel.2014.03.015

Cited by 3 publications

(2 citation statements)

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“…Additionally, Cu wire bonding with this protective layer exhibited better quality. When comparing the bonding of insulated Cu wire and bare Cu wire, HungYang Leong et al [ 36 ] found that samples with insulated Cu wire consistently produced larger first bond sizes, indicating that less energy was required for FAB formation in insulated Cu wire, as shown in Figure 2 . Furthermore, no organic insulation residues were observed on the FAB surface, suggesting that the organic insulation layer was completely burned during FAB formation.…”

Section: Types Of Cu-bonding Wirementioning

confidence: 99%

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Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Types Of Cu-bonding Wirementioning

confidence: 99%

“… Comparison of bare Cu and insulated Cu wire bonded samples. ( a ) Ball bond, ( b ) stitch bond, and ( c ) IMC coverage and pattern [ 36 ]. …”

Section: Figurementioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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In depth study of lead frame tape residuein quad flat non-leaded package

Nadaraja

Yap²

2019

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Purpose Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties. Originality/value This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution.

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