We managed to isolate the effects of electromigration in the dynamics of the step bunching process on the vicinal Si͑111͒ surface. Unlike in conventional experiments, we conducted the annealing of Si͑111͒ in a specially engineered setup enabling independent temperature control and an in-plane electric field. The primary result is that the step bunching process continues to take place at relatively low applied electric fields and ceases below E = 0.5 V / cm. Reduction in the electric field results in a significant expansion of step bunches width and elongation of the crossing steps running along the terraces. A theoretically predicted systematic increase in the number of crossing steps with reduced electromigration force has been experimentally observed. A distinct difference has been observed in the way that ͑1 ϫ 1͒ to ͑7 ϫ 7͒ phase transition manifests itself on the Si͑111͒ surfaces with a misorientation toward the ͓112͔ and ͓112͔ directions. DOI: 10.1103/PhysRevB.82.153301 PACS number͑s͒: 68.35.bg, 68.35.Rh, 68.35.Fx, 68.37.Ps Dynamics of atomic steps on vicinal crystal surfaces and the phenomenon of step bunching have long been of great scientific interest.1 This is particularly true for the key surfaces such as Si͑111͒ which is widely used in the semiconductor industry. This interest has however been particularly evident recently because the self-ordering and highly regular arrays of step bunches are strong candidates for the bottom-up fabricated templates sought for nanotechnological applications.
2,3Step bunching on Si͑111͒ is induced by means of an electric heating current, passed through the sample along the surface. The process is driven by the surface drift of Si adatoms in the direction of the current flow. 4 This drift results from the electromigration force acting on Si adatoms, which is defined as F ϵ q eff E, where q eff is the Si adatom effective charge and E is the applied electric field. While the influences of the annealing time, temperature, and current direction on the morphology of a bunched surface have been extensively investigated, 5-12 the effects of the electromigration force on the step bunching process have never been explicitly isolated. There are currently four recognized temperature regimes for the step bunching on Si͑111͒, 13 however in this study we operated in the regime II ͑ϳ1050-1190°C͒ where the step bunching takes place only when the heating current is driven in the step-up direction. In this regime, the step bunching process can be described within the framework of the transparent steps model, where the density of atomic step kinks is assumed to be low and most adatoms cross the steps without taking part in the exchange between the crystal phase and a layer of adatoms. 8 The model predicts the expansion of step bunches with reduced electromigration force, however this has not been observed experimentally to date. The strength in our approach was that we could stabilize the temperature and current independently, i.e., for every value of current we could adjust the power...