Instabilities and Plasma Flares in Moderate-Current Confined Magnetron Sputtering in Three Dimensions

Sahu, Bibhuti Bhusan; Wen, Long; Han, Jeon G.

doi:10.1103/physrevapplied.10.054042

Cited by 8 publications

(29 citation statements)

References 41 publications

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“…A stream of electrons, away from the target vicinity, into the plasma bulk, referred to as flares, have also been observed and associated with the spokes in HiPIMS operation (Ni et al 2012, Yang et al 2014 as well as in a HCM sputtering discharge (Sahu et al 2018). It has been suggested that there exist a tangential electric field in the direction along the race track parallel to the target surface.…”

Section: Instabilitiesmentioning

confidence: 99%

“…It has been suggested that there exist a tangential electric field in the direction along the race track parallel to the target surface. This tangential electric field E t is then claimed to disrupt the azimuthal electron drift as the electrons get reflected in the E t × B direction which is observed as a plasma jet or a flare that travels away from the target (Ni et al 2012, Sahu et al 2018. The flare velocity has been estimated to be roughly 20 km s −1 (Ni et al 2012, Sahu et al 2018.…”

Section: Instabilitiesmentioning

confidence: 99%

“…This tangential electric field E t is then claimed to disrupt the azimuthal electron drift as the electrons get reflected in the E t × B direction which is observed as a plasma jet or a flare that travels away from the target (Ni et al 2012, Sahu et al 2018. The flare velocity has been estimated to be roughly 20 km s −1 (Ni et al 2012, Sahu et al 2018. Oscillations observed in the frequency range 100-200 kHz have been related to the flares (Sahu et al 2018).…”

Section: Instabilitiesmentioning

confidence: 99%

“…The flare velocity has been estimated to be roughly 20 km s −1 (Ni et al 2012, Sahu et al 2018. Oscillations observed in the frequency range 100-200 kHz have been related to the flares (Sahu et al 2018). This tangential electric field is also expected to cause tangential ion acceleration.…”

Section: Instabilitiesmentioning

confidence: 99%

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Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

318

219

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Magnetron sputtering deposition has become the most widely used technique for deposition of both metallic and compound thin films and is utilized in numerous industrial applications. There has been a continuous development of the magnetron sputtering technology to improve target utilization, increase ionization of the sputtered species, increase deposition rates, and to minimize electrical instabilities such as arcs, as well as to reduce operating cost. The development from the direct current (dc) diode sputter tool to the magnetron sputtering discharge is discussed as well as the various magnetron sputtering discharge configurations. The magnetron sputtering discharge is either operated as a dc or radio frequency discharge, or it is driven by some other periodic waveforms depending on the application. This includes reactive magnetron sputtering which exhibits hysteresis and is often operated with an asymmetric bipolar mid-frequency pulsed waveform. Due to target poisoning the reactive sputter process is inherently unstable and exhibits a strongly non-linear response to variations in operating parameters. Ionized physical vapor deposition was initially achieved by adding a secondary discharge between the cathode target and the substrate and later by applying high power pulses to the cathode target. An overview is given of the operating parameters, the discharge properties and the plasma parameters including particle densities, discharge current composition, electron and ion energy distributions, deposition rate, and ionized flux fraction. The discharge maintenance is discussed including the electron heating processes, the creation and role of secondary electrons and Ohmic heating, and the sputter processes. Furthermore, the role and appearance of instabilities in the discharge operation is discussed.

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Section: Instabilitiesmentioning

confidence: 99%

Section: Instabilitiesmentioning

confidence: 99%

Section: Instabilitiesmentioning

confidence: 99%

Section: Instabilitiesmentioning

confidence: 99%

See 2 more Smart Citations

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

318

219

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show abstract

“…Based on the geometry and orientation of the cathodes, the design of MS devices is known as conventional MS (CMS) or planar MS, 99,108 dual MS (DMS), 102,113 facing target MS (FTMS), 105 cylindrical MS (CYMS), 107 and three-dimensional MS (3DMS). [99][100][101]103,104,106,107 Furthermore, MS devices utilize a closed magnetic field geometry. The MS devices are divided into balanced and unbalanced configurations based on the formation of magnetic fields.…”

Section: Introductionmentioning

confidence: 99%

Overall aspect for designing magnetron sputtering plasma sources and their applications in the deposition of ITO films

Nisha,

Sahu

2024

AIP Advances

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This work reports a systematic review of the studies of magnetron sputtering (MS) discharges and their utilities for the deposition of transparent coating oxide thin films like indium tin oxides (ITOs). It collates the overall information of plasma science, diagnostics, and chemistry and their usefulness in controlling the plasma process, film growth, and properties. It discusses studies on various MS systems and their capabilities and reports scientific aspects like the formation of instability and plasma flares to understand the various discharge phenomena. The study also discusses various issues, progress, and challenges in ITO films for industrial applications. In addition, this work highlights the importance of plasma parameters and energy flux on thin film growth and film properties.

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A modified expression for breakdown voltage of Townsend discharge in a non-uniform electric field and uniform axial magnetic field

Noori

Jõgi

2022

Physics Letters A

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Instabilities and Plasma Flares in Moderate-Current Confined Magnetron Sputtering in Three Dimensions

Cited by 8 publications

References 41 publications

Physics and technology of magnetron sputtering discharges

Physics and technology of magnetron sputtering discharges

Overall aspect for designing magnetron sputtering plasma sources and their applications in the deposition of ITO films

A modified expression for breakdown voltage of Townsend discharge in a non-uniform electric field and uniform axial magnetic field

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