2010
DOI: 10.1063/1.3309420
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Insights into the reactive ion etching mechanism of nanocrystalline diamond films as a function of film microstructure and the presence of fluorine gas

Abstract: Articles you may be interested inMicrostructure-controlled depth gradients of mechanical properties in thin nanocrystalline films: Towards structure-property gradient functionalization Interdependence between stress, preferred orientation, and surface morphology of nanocrystalline TiN thin films deposited by dual ion beam sputtering

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Cited by 4 publications
(4 citation statements)
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“…The chemical etching rate of diamond exceeds the ion sputtering rate. The role of the ion bombardment mostly consists in that defects are created in the surface layer, which makes lower the energy barrier for the chemical etching reaction [27].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The chemical etching rate of diamond exceeds the ion sputtering rate. The role of the ion bombardment mostly consists in that defects are created in the surface layer, which makes lower the energy barrier for the chemical etching reaction [27].…”
Section: Resultsmentioning
confidence: 99%
“…To reduce the imperfection of the crystal lattice, diamond particles are subjected to a post-treatment via etching in oxygen, during which sp 2 carbon and defective diamond regions are removed [23][24][25][26][27][28][29]. However the problem of obtaining low-defect and low-strain nanodiamonds containing SiV colour centres remains unsolved.…”
Section: Introductionmentioning
confidence: 99%
“…There are no values for 15 s O 2 plasma exposures of bulk RuO 2 because these contact closures could not be fitted by a power law relation. [33][34][35][36] Prior to, and for short oxygen plasma exposure times, bulk RuO 2 resistance values exhibited much larger variations than values measured for surface RuO 2 , which can be attributed to a higher degree of susceptibility to physisorbed hydrocarbons that are not removed by vacuum conditions ͑10 −8 Torr͒ alone. for these samples and they exhibited far more variability in their initial values than the "surface" Ru samples.…”
Section: B Snl Bulk and Surface Oxide Comparisonsmentioning
confidence: 97%
“…The subsequent incident O* atoms bombardment may also chemically etch the damaged diamond surface by reacting with the sp 2 -bonded carbon preferentially, while the sp 3 -bonded carbon in diamond remains intact. The main advantage of CF 4 addition in the etching plasma is to reduce the surface roughness of the etched diamond. , The discharge of CF 4 molecule by electron impact can generate the CF 3 – , CF 3 , CF 2 , F – , and F ions in the reactive plasma of RIE, which have been observed at wavelengths of 599.0 nm for CF 3 and 637.0 nm for the F ion, respectively.…”
Section: Resultsmentioning
confidence: 54%