“…Besides, an analysis was carried out on the stress absorption capacity of the silicone-based thermal paste covering the upper electronic board and filling the 4 mm-gap with the housing (alongside copper and graphite heat dissipators). Structuring the silicone-based thermal paste could allow to optimize its deformation capacities and therefore its energy dissipation, while keeping its original function as a heat exchanger (19). The simulations performed in the present study gave consistent results in comparison with the hammer tests.…”