Inside a power module...

Martin, Christian; Schanen, Jean‐Luc; Pasterczyk, Robert

doi:10.1109/ias.2004.1348672

Cited by 22 publications

(17 citation statements)

References 11 publications

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“…The layout has a strong effect on these parasitic elements. Thus, keeping parasitic effects low is a major requirement in order to reduce electric power losses, overvoltages and poor current balance during switching phases [2]. Long distances between chips improve the thermal dissipation of power modules, since heat spreads more easily.…”

Section: Introductionmentioning

confidence: 99%

Layout optimization of power modules using a sequentially coupled approach

Hammadi¹,

Choley²,

Penas³

2011

Int. j. simul. model.

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Nowadays, the design of Power Modules (PM) is shared between multidisciplinary teams of designers using various modelling tools. Consequently, optimizing the layout of PM is a long process with high risk of errors.In this paper, a sequentially coupled approach is proposed to optimize this process. This integrated method is based on coupling physical models and applying an optimization process. It is illustrated through the example of the layout of a half-bridge Mosfet power module exposed to electric and thermal constraints. So, physical models and software components have been developed, in order to define the multidisciplinary design process and then to perform the layout optimization using the NLPQL algorithm.It is shown that, the proposed approach allows automatic data exchange between physical models and optimal configurations are proposed with reduced design time and risk. Therefore, this integrated approach shows a great improvement in the design of PM and multidisciplinary products.

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Section: Introductionmentioning

confidence: 99%

Layout optimization of power modules using a sequentially coupled approach

Hammadi¹,

Choley²,

Penas³

2011

Int. j. simul. model.

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show abstract

“…Clearance in inches=0.023"+(0.0002"×V) (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17) where, V is the voltage peak across traces.…”

Section: Example 3 Planar Inductormentioning

confidence: 99%

“…It consists of the low frequency model developed earlier [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] with a lumped high frequency branch connected in parallel. The parameters required for modeling the low frequency model are calculated by nonlinear finite element solutions.…”

Section: Problem Statementmentioning

confidence: 99%

“…Furthermore, such software needs interfaces so that data can be exchanged easily between different programs. For example, the thermal simulator giving a thermal network model of a power module must provide the ability to directly export this network into a circuit simulator so that transient junction temperatures can be calculated [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27].…”

Section: Software Requirementsmentioning

confidence: 99%

“…The field vectors allow identifying critical chip placements and substrate layouts, where strong magnetic fields might induce unwanted voltages in the gate signal loops. Transient simulations using extracted impedance matrices and accurate IGBT and diode models show how these induced voltages affect the dynamic current sharing [7], [15], [40][41][42].…”

Section: Igbt Module Design Optimizationmentioning

confidence: 99%

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