Insertion Structures for Transparent Metal Electrodes Prepared by Nanoimprint Lithography

Abstract

This paper proposed an efficient process for manufacturing stable insertion structures inside poly(methyl methacrylate) (PMMA) substrates through only three steps, i.e., nanoimprint, metal deposition, and burnishing. The insertion structures with potential applications in transparent metal electrodes possess the advantages of being able to avoid the embedded nanostructure from damage due to contamination or stresses during packaging or transportation. In this paper, the Cu mesh of the insertion structure was successfully replicated into the PMMA substrate. The inserted Cu mesh electrode acquires an average optical transmittance of 84.6% in the visible regime and sheet resistance of 26.78 Ω/□.