2017
DOI: 10.1109/jproc.2017.2692178
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InP HBT Technologies for THz Integrated Circuits

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Cited by 206 publications
(95 citation statements)
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“…[4][5][6][7] Operating frequency of oscillators with electron devices has also been rapidly increasing from the millimeter wave side. [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] Among the electron devices, resonant tunneling diodes (RTDs) have been considered as one of the candidates for compact THz oscillators at room temperature. [16][17][18][19][20][21][22][23] Oscillations up to 1.98 THz 23 and relatively high output power in the sub-THz region 24 have been reported for these oscillators.…”
Section: Introductionmentioning
confidence: 99%
“…[4][5][6][7] Operating frequency of oscillators with electron devices has also been rapidly increasing from the millimeter wave side. [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] Among the electron devices, resonant tunneling diodes (RTDs) have been considered as one of the candidates for compact THz oscillators at room temperature. [16][17][18][19][20][21][22][23] Oscillations up to 1.98 THz 23 and relatively high output power in the sub-THz region 24 have been reported for these oscillators.…”
Section: Introductionmentioning
confidence: 99%
“…Owing to the high frequency capabilities and moderate breakdown voltage, InP DHBTs have revealed well suited for mm‐wave PA implementations. In highly scaled processes, frequencies of operation can reach even the terahertz range . The InP DHBT technology employed in this design and developed at III‐V Lab is tailored for high‐speed mixed‐signal applications .…”
Section: Inp Dhbt Technologymentioning
confidence: 99%
“…In highly scaled processes, frequencies of operation can reach even the terahertz range. 8 The InP DHBT technology employed in this design and developed at III-V Lab is tailored for high-speed mixedsignal applications. 9 For the stacked-transistor power cells, 4-finger devices with total active area of 4 × 0.7 × 10 ÎŒm 2 have been used.…”
Section: Inp Dhbt Technologymentioning
confidence: 99%
“…It also makes CPW and CPS versatile for designing components and chips based on different substrates and packaging them into a system. In communication systems, CPW in a ground-signal-ground (GSG) configuration is normally used for designing amplifiers [2][3][4][5], frequency doublers [6,7], mixers [8,9], power DACs (PDACs) [10,11] and interposer connections between different components [12,13]. Being different from CPW, CPS as well as ACPS are in a ground-signal (GS) configuration and they are used for designing baluns [14][15][16][17], antennas [18][19][20], and the electrodes of Mach-Zehnder modulators (MZMs) [21][22][23].…”
Section: Introductionmentioning
confidence: 99%