Innovative optical techniques used in the Raman instrument for ExoMars

Ferrando, Sebastian; Galán, Miguel Á.; Thiele, Hans; Glier, Markus; Goepel, Michael

doi:10.1117/12.2309122

Cited by 3 publications

(3 citation statements)

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“…All the components are placed in a laser housing made of oxygen-free, high-conductivity copper with a gold coating. The main optical components are placed over KOVAR pads on the laser board by using a solder jet bump technique (Ferrando et al, 2010). Solder jet bumping is a low-stress, highly stable, organic-free soldering technique.…”

Section: Laser Descriptionmentioning

confidence: 99%

The Raman Laser Spectrometer for the ExoMars Rover Mission to Mars

et al. 2017

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The Raman Laser Spectrometer (RLS) on board the ESA/Roscosmos ExoMars 2020 mission will provide precise identification of the mineral phases and the possibility to detect organics on the Red Planet. The RLS will work on the powdered samples prepared inside the Pasteur analytical suite and collected on the surface and subsurface by a drill system. Raman spectroscopy is a well-known analytical technique based on the inelastic scattering by matter of incident monochromatic light (the Raman effect) that has many applications in laboratory and industry, yet to be used in space applications. Raman spectrometers will be included in two Mars rovers scheduled to be launched in 2020. The Raman instrument for ExoMars 2020 consists of three main units:(1) a transmission spectrograph coupled to a CCD detector; (2) an electronics box, including the excitation laser that controls the instrument functions; and (3) an optical head with an autofocus mechanism illuminating and collecting the scattered light from the spot under investigation. The optical head is connected to the excitation laser and the spectrometer by optical fibers. The instrument also has two targets positioned inside the rover analytical laboratory for onboard Raman spectral calibration. The aim of this article was to present a detailed description of the RLS instrument, including its operation on Mars. To verify RLS operation before launch and to prepare science scenarios for the mission, a simulator of the sample analysis chain has been developed by the team. The results obtained are also discussed. Finally, the potential of the Raman instrument for use in field conditions is addressed. By using a ruggedized prototype, also developed by our team, a wide range of terrestrial analog sites across the world have been studied. These investigations allowed preparing a large collection of real, in situ spectra of samples from different geological processes and periods of Earth evolution. On this basis, we are working to develop models for interpreting analog processes on Mars during the mission.

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Section: Laser Descriptionmentioning

confidence: 99%

The Raman Laser Spectrometer for the ExoMars Rover Mission to Mars

et al. 2017

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“…The current baseline design includes only the internal Raman optical sensor head, positioned over the sample distribution system, one spectrometer and one redundant laser assembly. The system is described more detailed in [2].…”

Section: Icso 2014mentioning

confidence: 99%

Optical fiber technology for space: challenges of development and qualification

Goepel

2017

International Conference on Space Optics — ICSO 2014

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“…Laser manufacturers are nowadays driven by the wide variety of laser applications to build compact and robust devices that are able to perform in more stringent conditions [1]. To fulfill such demands, the common assembling techniques using clamping or adhesive means have to be substituted with more sophisticated approaches which enable components miniaturization (making them unsuitable for clamping methods), and more robust manufacturing that could offer a higher operational thermal range, vacuum compatibility or even the ability to withstand space radiation (making them unsuitable for adhesive techniques) [2].…”

Section: Introductionmentioning

confidence: 99%

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Ribes-Pleguezuelo

Septriani

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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Background: Low-stress soldering techniques can guarantee a minimized input of thermal energy allowing for the design and later assembly of more robust and miniaturized optical devices. However, in order to build miniaturized optical devices, these small-induced stresses produced by soldering techniques have to be investigated to guarantee that the stress-induced birefringence effects do not alter the device optical properties and requirements. Methods: An analytical method that relates the stress-induced birefringence of laser components with their corresponding lasing capabilities has been compared to the real induced-stress results created in components packaged using solderjet technology. The main goal was to optimize the optical component packaging by using this low induced-stress soldering technique. The optimization was carried out by assessing components miniaturization while still assuring high robustness of the bond strength without creating a beam depolarization ratio of more than 1%. Results: The outcome of the study showed the possibility of assembling laser optical components down to sizes of around 300 μm, creating a bond strength of 5 N and higher, and a depolarization ratio much lower than the proposed target of 1%. Conclusions: Our results in terms of induced stress agreed with the finite element method result, which would imply correct post-processing laser simulations. This suggested that the solderjet bumping technique could robustly join components down to the laser emission beam size without strongly affecting the optical properties.

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Innovative optical techniques used in the Raman instrument for ExoMars

Cited by 3 publications

References 0 publications

The Raman Laser Spectrometer for the ExoMars Rover Mission to Mars

The Raman Laser Spectrometer for the ExoMars Rover Mission to Mars

Optical fiber technology for space: challenges of development and qualification

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

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