“…However, the edge effect of the wafer edge has not been improved. Tsai et al [116] have developed a similar method to improve the non-uniformity. They have combined the pad which was faced down with an online measurement and real-time feedback to achieve a better uniformity and eliminate the edge effects.…”
Section: Improvement Of the Non-uniformitymentioning
“…However, the edge effect of the wafer edge has not been improved. Tsai et al [116] have developed a similar method to improve the non-uniformity. They have combined the pad which was faced down with an online measurement and real-time feedback to achieve a better uniformity and eliminate the edge effects.…”
Section: Improvement Of the Non-uniformitymentioning
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