2020
DOI: 10.1016/j.cose.2019.101665
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Inner conflict: How smart device components can cause harm

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Cited by 4 publications
(1 citation statement)
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“…Side-Channel Analysis. System-level delay side-channel information (such as based on JTAG [28], I2C [46]), power side-channel information [42], or combined multiparameter side-channel analysis [19] can be utilized to perform anomaly detection and run-time monitoring. Although, power and delay side-channel leakage are fundamentally caused by the PDN of target devices, their analysis is usually limited to specific anomaly types and offers only partial PCB area coverage.…”
Section: Related Workmentioning
confidence: 99%
“…Side-Channel Analysis. System-level delay side-channel information (such as based on JTAG [28], I2C [46]), power side-channel information [42], or combined multiparameter side-channel analysis [19] can be utilized to perform anomaly detection and run-time monitoring. Although, power and delay side-channel leakage are fundamentally caused by the PDN of target devices, their analysis is usually limited to specific anomaly types and offers only partial PCB area coverage.…”
Section: Related Workmentioning
confidence: 99%