Inkjet-Printed Temperature Sensors Characterized according to Standards

Abstract

This paper describes the characterization of inkjet-printed resistive temperature sensors according to the international standard IEC 61928-2. The goal is to evaluate such sensors comprehensively, to identify important manufacturing processes, and to generate data for inkjet-printed temperature sensors according to the mentioned standard for the first time, which will enable future comparisons across different publications. Temperature sensors were printed with a silver nanoparticle ink on injection-molded parts. After printing, the sensors were sintered with different parameters to investigate their influences on the performance. Temperature sensors were characterized in a temperature range from 10 °C to 85 °C at 60% RH. It turned out that the highest tested sintering temperature of 200 °C, the longest dwell time of 24 h, and a coating with fluoropolymer resulted in the best sensor properties, which are a high temperature coefficient of resistance, low hysteresis, low non-repeatability, and low maximum error. The determined hysteresis, non-repeatability, and maximum error are below 1.4% of the full-scale output (FSO), and the temperature coefficient of resistance is 1.23–1.31 × 10−3 K−1. These results show that inkjet printing is a capable technology for the manufacturing of temperature sensors for applications up to 85 °C, such as lab-on-a-chip devices.

Material jetting of carbon nano onions for printed electronics

“…For temperatures above that range, the resistivity starts increasing with temperature, as a result of the disturbance of carrier motion caused by thermal vibrations of the carbon hexagonal lattice, which would cancel the effect of the carrier density increment initially occurring [60]. When comparing the TCR of our printed materials with other printed temperature sensors in the literature, we observe that our values (∼10 −2 K −1 ) are approximately one order of magnitude higher than previously reported (∼10 −3 K −1 ) [61][62][63]. In the case of the printed Ag test lines, we postulate that such a high temperature dependency may be due to the low curing temperature used in our work (120 °C for 60 min), which results in printed structures with more defects and thus less resemblance to the bulk material.…”

Study of Single and Multipass f–rGO Inkjet-Printed Structures with Various Concentrations: Electrical and Thermal Evaluation

“…[ 5 , 6 , 7 ], with low material consumption and almost zero waste [ 8 ]. It is effective for the fabrication of a variety of complex electronic components and devices such as: sensors (gas [ 9 , 10 ], temperature [ 11 , 12 , 13 , 14 ], and humidity [ 14 , 15 ]), microheaters [ 16 , 17 , 18 ], energy harvesters, capacitors, FETs, etc. [ 19 , 20 , 21 , 22 ].…”