Inkjet‐printed interconnects for unpackaged dies in printed electronics

Abstract

This work details manufacturing processes developed to integrate an unpackaged silicon die onto a paper substrate, as part of constructing a hybrid inkjet-printed paper-based circuit. This integration between rigid components and flexible substrates is beneficial in low-cost applications and capitalises on the advantages of both the well-established integrated circuit technology and the emerging paper-based electronics platforms. A superglue incline at the chip edge formed a ramp for printing the silver interconnects between the paper-based circuit and the chip pads. Two printing protocols are compared, the first a single layer using 5 μm drop spacing, and the second using a 35 μm drop spacing for three layers. An unpackaged RFID tag die is successfully integrated and is presented as proof of concept.

Printed Smart Devices on Cellulose-Based Materials by means of Aerosol-Jet Printing and Photonic Curing

“…The reason of the interest in paper materials is related to its unique combination of properties, like biodegradability, biocompatibility, and renewability, thus reducing waste production, important aspects in an environmental-friendly manufacturing context [1]. Paper-based substrates show an intrinsic versatility since different kind of paper can be used as suitable materials depending on the application, from printer paper [2,3], glossy brochure paper, newspaper, cardboard [4] to photopaper [5], and chromatographic paper [6]. Being a disposable material, paper-based sensors have proven their validity in studies of biological samples in laboratories, but they can show their usefulness in resource-limited situations owing to low-cost, robustness and ease-of-disposal, simply burning the device in presence of biological samples avoiding sterilization [7,8].…”

Wireless colorimetric readout to enable resource-limited point-of-care

“…52 A recent example showcasing printed photodiode arrays 53 could be applied for multiplexed tests and more complex readouts in future. The in-house development of an inkjet printed RFID tag on photo paper using the die format of the SL900A chip has successfully been demonstrated, 54 and has also been initially explored for screen printed tags (Fig. S17 †), indicating promise for a more flexible, low-cost and readily disposable solution for this key RFID tag component.…”