Initial Stages of Electromonocrystallization of Nickel on Copper-Film Substrates

Abstract

The first stage of eleetromonocrystallization, the growth of single-crystal electrodeposits, in a number of instances is the developmen~ of three-dimensional, epitaxial crystallRes (TEC). The absence or presence of TEC as well as their morphology is determined by the codeposited foreign species, either intentionally added or apparently resulting from a high pH in the solution adjacent to the cathode. When a complete deposit layer has formed, strains result from the difference between the lattice dimensions of the deposit and substrate as well as from the coalescence of TEC. Surface undulations are also related to the joining of TEC. Dislocations of the misfit type develop at certain deposit thicknesses; their spacing and straightness again are related to the presence of foreign substances. The coalescence of TEC and possibly of atom layers too thin to be visible also results in dislocation and twin formation.* Electrochemical Society Active Member. ABSTRACTThe PSMD imaging system employs aqueous SnC12 sensitizer solutions to generate electroless metal photopatterns on dielectric substrates. We have measured how aging in several typical sensitizer solutions affects their ability to generate electroless copper photopatterns on polyimide H film (DuPont Kapton@). Specimens, consecutively sensitized as the solution aged, have been characterized with respect to (i) tin deposition (by x-ray fluorescence), (ii) catalytic activity for metalization (by optical density determination of the deposited electroless copper), and (iii) imageability (by image contrast measurements of the developed copper patterns). The system Jmageability is found highly dependent on the sensitizer solution age, while the capability for blanket metalization was relatively unaffected.Photoselective metal deposition (PSMD), a process for metal patterning dielectric substrates by uv light exposure and electroless (chemical) plating, has been the subject of several recent papers (1-4). These have * Electrochemical Society Active Member.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.122.253.212 Downloaded on 2015-07-24 to IP

The influence of substituted aromatic aldehydes on Zn-Mn alloy electrodeposition

“…This is consistent with the literature, because it was reported, for example, that the brightening of a nickel deposit was accompanied by a cathode polarization of only 20 mV. 34 Based on the overpotential change seen in Fig. 5, it could be assumed that a more uniform distribution of the adsorbed additive molecules could occur on the surface when a higher additive concentration is applied, leading to significant reduction in the Zn-Mn aggregate size, which resulted in a smoother appearance.…”

Stereomicroscopic Method for Studying the Incorporation of Organic Molecules in Electrodeposited Films

“…1. The plating condition and the molecular structure of phenosafranine were previously described (6). The images in Fig.…”

The Effect of Copper and Silver Substrates on the Structure, Internal Stress, and Electrode Potential during the Initial Stages of Gold Electrodeposition

“…In any plating process, the supply of ions to the electrode surface is often limiting. Thus during the plating of copper under steady-state conditions effects due to the depletion of ions at the cathode (e.g., uneven deposit, hydrogen embrittlement in galvanostatic plating) are often seen (1). Methods involving agitation or air sparging (2) may alleviate these problems by reducing the thickness of the diffusion layer, but pulse techniques (3) have been shown to provide the best possibility of obtaining an even deposit with an efficient use of the current (1,4,5).…”

“…Thus during the plating of copper under steady-state conditions effects due to the depletion of ions at the cathode (e.g., uneven deposit, hydrogen embrittlement in galvanostatic plating) are often seen (1). Methods involving agitation or air sparging (2) may alleviate these problems by reducing the thickness of the diffusion layer, but pulse techniques (3) have been shown to provide the best possibility of obtaining an even deposit with an efficient use of the current (1,4,5). Three methods employing periodically changing currents have been proposed; all are based on an "off" period when the depleted layer of ions at an electrode may be replenished.…”