1992
DOI: 10.1016/0039-6028(92)90855-z
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Initial stage of underpotential deposition of Pb on reconstructed and unreconstructed Au(111)

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Cited by 85 publications
(75 citation statements)
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“…The shape of CV in general and the positions of the UPD peaks in particular of metal electrodes are known to be very sensitive to the surface structure and order. [7][8][9][10][11] After the deposition of palladium in 50 mM H 2 SO 4 solution containing 0.01 mM PdCl 4 2-at 0.7 V for 30 min (ca. 2 ML), the electrode was rinsed with milli-Q water.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The shape of CV in general and the positions of the UPD peaks in particular of metal electrodes are known to be very sensitive to the surface structure and order. [7][8][9][10][11] After the deposition of palladium in 50 mM H 2 SO 4 solution containing 0.01 mM PdCl 4 2-at 0.7 V for 30 min (ca. 2 ML), the electrode was rinsed with milli-Q water.…”
Section: Resultsmentioning
confidence: 99%
“…Recently, in situ techniques for surface characterization in an electrolyte solution such as STM, 1 atomic force microscopy (AFM), [1][2][3] EQCM, 4 and surface X-ray scattering (SXS) 5,6 were applied for the investigation of the electrochemical deposition process. Although many reports are available for in situ observation of so-called underpotentially deposited (UPD) metal layers such as copper, 7 silver, 8 lead, 9 bismuth, 10 and tellurium, 11 the investigation of the electrochemical deposition process with atomic resolution is rather limited and only limited evidence has been provided for the adsorption of the reactant, [12][13][14][15] i.e., metal ions, on the electrode surface during the electrochemical deposition.…”
Section: Introductionmentioning
confidence: 99%
“…It is particularly interesting to investigate the surface structure of the electrode during metal deposition when metal complexes are used as a reactant. Although many reports are available for the in situ observation of so-called underpotentially deposited (UPD) metal layers such as copper, [1][2][3][4] silver, 5-9 and lead, 10 the investigation of the electrochemical deposition process on an atomic level is rather limited and no evidence has been given for the adsorption of the reactant, i.e., metal ions, on the electrode surface during the electrochemical deposition.…”
Section: Introductionmentioning
confidence: 99%
“…Tao et al 27 found evidence, using electrochemical scanning tunelling microscopy (ECSTM), for a two-step deposition process correlated to the double peak found in the cyclic voltammogram. This two-step adsorption process was also seen by Schmidt and Wuthrich 28 using ECSTM.…”
Section: Discussionmentioning
confidence: 96%