“…Recently, in situ techniques for surface characterization in an electrolyte solution such as STM, 1 atomic force microscopy (AFM), [1][2][3] EQCM, 4 and surface X-ray scattering (SXS) 5,6 were applied for the investigation of the electrochemical deposition process. Although many reports are available for in situ observation of so-called underpotentially deposited (UPD) metal layers such as copper, 7 silver, 8 lead, 9 bismuth, 10 and tellurium, 11 the investigation of the electrochemical deposition process with atomic resolution is rather limited and only limited evidence has been provided for the adsorption of the reactant, [12][13][14][15] i.e., metal ions, on the electrode surface during the electrochemical deposition.…”