Abstract:Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser printing are being investigated for low-cost ultra-fine pitch printing applications. This paper will investigate the feasibility of using solder particles in of the shelf xerographic technology. The physics of the two development systems (dual component and monocomponent) will be discussed. This inquisition will lead … Show more
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