2012
DOI: 10.1002/pssc.201100209
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Initial experiments in the migration enhanced afterglow growth of gallium and indium nitride

Abstract: Some initial results are presented for gallium nitride and indium nitride thin films grown on c‐plane sapphire using a prototype migration enhanced afterglow (MEAglow) system. Smooth surfaces of less than 1 nm root mean square surface roughness have been achieved for both InN and GaN films at growth temperatures of 450‐560 °C and 665 °C respectively. This result is attributed to the increased adatom diffusion length allowed for the metal species during the growth process. Thicker GaN layers can now be grown th… Show more

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Cited by 9 publications
(9 citation statements)
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“…For the current experiments, the MEAglow [6][7][8] growth technique with pulsed metal precursor delivery has been used to help identify the physical processes that resulted from equipment changes; further details of film growth not found here can be found in the references cited. During this pulsed deposition, a metal layer is deposited and then subsequently nitrided with a nitrogen plasma to form a group III nitride semiconductor layer.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…For the current experiments, the MEAglow [6][7][8] growth technique with pulsed metal precursor delivery has been used to help identify the physical processes that resulted from equipment changes; further details of film growth not found here can be found in the references cited. During this pulsed deposition, a metal layer is deposited and then subsequently nitrided with a nitrogen plasma to form a group III nitride semiconductor layer.…”
Section: Methodsmentioning
confidence: 99%
“…For the current experiments, a deposition technique with pulsed metalorganic delivery, "MEAglow" (Migration Enhanced Afterglow), [6][7][8] has been used to help identify the physical processes that resulted from the use of an RF plasma source operating at 13.56 MHz. In particular, we examined the case of GaN film growth for which there has been some past characterisation of metal adatom species on the surface.…”
Section: Introductionmentioning
confidence: 99%
“…[28] SiO 2 (PE-ALD) [7,24,25] β-Ga 2 O 3 (PE-ALD) [38] Silicon nitride (PE-ALD) [22,23,27,31,37,40] Plasma treatment (PE-ALD) [26] Electron treatment (CVD based) [36,39] GaN (CVD based) [42,44,45,55] InN (CVD based) [41][42][43]45,47,48,53,57,58] InGaN (CVD based) [49,51,54,56] InN nanopillars (CVD based) [46,50,52,55] The oxygen contamination overview provided in this introduction is followed by an experimental examination of some effects related to the surface modification of cathode materials by the generated plasma. In particular, we examine changes that have been observed for aluminum and stainless-steel cathodes.…”
Section: Materials (And Process) Referencementioning
confidence: 99%
“…Interest in the use of hollow cathodes for PE-ALD came about because of some low oxygen contamination results for GaN films grown using a relatively low-temperature means of deposition based on migration-enhanced epitaxy [42,44]. This is a pulsed method for deposition of GaN at temperatures below 670 • C, much lower than typical MOCVD growth temperatures of over 950 • C. However, ALD-like smoothness could be obtained with root mean square atomic force microscopy roughness measurements of below 1 nm [42,44,55] and, more importantly, when grown on GaN templates, oxygen contamination levels of ~10 16 cm −3 were measured by SIMS [42], similar to the levels of commercial MOCVDgrown material. Migration-enhanced epitaxy with a hollow cathode plasma source has also shown some excellent results for InN [41,42,47,48] and InGaN [49].…”
Section: Materials (And Process) Referencementioning
confidence: 99%
“…The theoretical conclusions are made on the basis of previous author's contributions [1,2]. The hetero-junctions are designed and technologically produced in the Semiconductor Research Laboratory at Lakehead University by new technology that is developed in this lab [3][4][5]. In fact, this type hetero-junction represents further development of this technology toward the development of electronic devices.…”
Section: Introductionmentioning
confidence: 99%