Inhibition of copper corrosion by modifying cysteine self‐assembled film with alkylamine/alkylacid compounds

Zhang, D.-Q.; Gao, Lin; Cai, Qi-Rui; Lee, K. Y.

doi:10.1002/maco.200905225

Cited by 27 publications

(11 citation statements)

References 36 publications

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“…Since then, many different substances on different metals and alloys have been proven to be effective against corrosion. The list includes thiols [6][7][8][9][10][11][12][13][14][15][16][17][18][19], amines [12], phosphates [20], sulfates [21], thiosulfates [22], carboxylic acids [23][24][25][26][27][28][29], hydroxamic acids [29][30][31], amino acids [32][33][34], phosphonic acids [29,35], sulfonic acids [29], silane derivatives [36], as well as heterocyclic and other compounds [16,[37][38][39][40][41][42][43][44].…”

Section: Introductionmentioning

confidence: 99%

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Románszki

Datsenko

May

et al. 2014

Bioelectrochemistry

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Dip-coated polystyrene layers of sub-micrometre thickness (85-500 nm) have been applied on copper and copper alloys (aluminium brass, copper-nickel 70/30), as well as on stainless steel 304, and produced an effective barrier against corrosion and adhesion of corrosion-relevant microorganisms. According to the dynamic wettability measurements, the coatings exhibited high advancing (103°), receding (79°) and equilibrium (87°) contact angles, low contact angle hysteresis (6°) and surface free energy (31 mJ/m 2 ). The corrosion rate of copper-nickel 70/30 alloy samples in 3.5% NaCl was as low as 3.2 µm/a (44% of that of the uncoated samples), and in artificial seawater was only 0.9 µm/a (29% of that of the uncoated samples). Cell adhesion was studied by fluorescence microscopy, using monoculture of Desulfovibrio alaskensis. The coatings not only decreased the corrosion rate but markedly reduced the number of bacterial cells adhered to the coated surfaces. The PS-coating on copper gave the best result, 2×10 3 cells/cm 2 (1% of that of the uncoated control).

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Section: Introductionmentioning

confidence: 99%

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Románszki

Datsenko

May

et al. 2014

Bioelectrochemistry

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“…The modified surface blocks the approach of electrochemically active species to the electrode surface, resulting in a complete suppression of their redox reactions at the electrode surface. The corrosion inhibition will be prominent in organic molecules due to their higher resistivity to electron transfer reactions [4][5][6][7][8][9][10][11][12][13][14][15][16][17]. They form a thin resistive layer on the metal surface and protect it from the surrounding reactive environment.…”

Section: Introductionmentioning

confidence: 99%

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

et al. 2012

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“…In addition to the anodic processes, the dominant cathodic process in the examined solution is a process of oxygen reduction [37]:…”

Section: Cyclic Voltammetry Cyclic Voltammogram Of Brass Obtained Inmentioning

confidence: 99%

Protection of Brass in HCl Solution by L‐Cysteine and Cationic Surfactant

Radovanović

Tasić

Mihajlović

et al. 2018

Advances in Materials Science and Engineering

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Electrochemical behavior of brass and inhibitory effect of L-cysteine in HCl solution are investigated using electrochemical techniques in addition to SEM-EDS analysis. Results show that inhibition efficiency depends on inhibitor concentration and immersion time of brass electrode in inhibitor solution. Electrochemical test results point to formation of Cu(I)-cysteine complex on the brass surface in chloride solutions with addition of different amounts of cysteine. e formed complex has an important role in inhibition of the corrosion process in the examined media because Cu(I)-cysteine significantly reduces dissolution of brass. Curves obtained in acidic solution in the presence of cysteine after pretreatment in sodium dodecyl sulfate (SDS) by cyclic measurements and potentiodynamic polarization measurements indicate intense inhibition of corrosion processes. Efficient inhibition of brass dissolution is result of formation of a stable protective layer on the brass surface after pretreatment of the electrode in SDS solution. e brass surface is modified in sodium dodecyl sulfate solution in order to increase cysteine adsorption on the electrode surface and to improve inhibition efficiency. Inhibition mechanism of cysteine includes adsorption on active sites on the electrode surface, which is confirmed by SEM-EDS analysis of brass. Adsorption of cysteine in hydrochloric acid solution obeys the Langmuir adsorption isotherm. Also, Gibbs free energy of adsorption has a value of −31.5 kJ/mol and indicates strong adsorption of cysteine on the electrode surface.

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Inhibition of copper corrosion by modifying cysteine self‐assembled film with alkylamine/alkylacid compounds

Cited by 27 publications

References 36 publications

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

Protection of Brass in HCl Solution by L‐Cysteine and Cationic Surfactant

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