Inhibition activity of ethyleneglycol and its oligomers on tin electrode

Survila, Arvydas; Bražinskienė, Dalia

doi:10.1007/s10008-005-0070-2

Cited by 14 publications

(8 citation statements)

References 19 publications

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“…In contrast, the inhibition ability of Sintanol on tin has been observed many times [8,10,[13][14][15][16][17][18][19][20]. According to [16,21], the length of the hydrocarbon chain is the major factor responsible for the inhibition activity of polyethers on tin, e.g. oligomers of ethylene glycol HO-(CH 2 -CH 2 -O) m -H demonstrate surfactant properties only when m C 4 [21].…”

Section: Introductionmentioning

confidence: 94%

“…According to [16,21], the length of the hydrocarbon chain is the major factor responsible for the inhibition activity of polyethers on tin, e.g. oligomers of ethylene glycol HO-(CH 2 -CH 2 -O) m -H demonstrate surfactant properties only when m C 4 [21]. Sintanol is a much more powerful surfactant, and its inhibitive effect can be detected even at very low concentrations (*0.5 mg dm -3 ) [13].…”

Section: Introductionmentioning

confidence: 98%

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Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Survila¹,

Mockus²,

Kanapeckaitė³

et al. 2009

J Appl Electrochem

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Cu(II) and Sn(II) reduction in acid sulphate solutions containing polyether laprol DS-10 and benzaldehyde (BA) was studied by means of impedance, voltammetric, XPS and XRD techniques. Both additives demonstrate weak surface activity on copper substrate in Cu(II) solutions in the absence of halide impurities. In contrast, their effect is overwhelmingly higher in the Sn|Sn(II) system. The additives induce a significant increase in Sn-electrode impedance and simultaneous strong inhibition of Sn(II) reduction over a wide range of cathodic polarizations. The effects of sintanol and BA in mixed Cu(II) and Sn(II) solutions demonstrate a kind of synergism. Underpotential deposition of tin on foreign (copper) substrate is observed at potentials more positive than the equilibrium potential of the Sn|Sn 2? system. Incorporation of tin into the Cu crystalline lattice results in the formation of multiphase material containing pure copper, a-CuSn phase, and intermediate hexagonal hcp phase. Formation of the pure tin phase occurs at more negative potentials and results in a strong inhibitive adsorption that manifests itself in the development of a deep voltammetric minimum. The tin content in the coatings depends on BA concentration and, particularly, on the electrode potential.

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Section: Introductionmentioning

confidence: 94%

Section: Introductionmentioning

confidence: 98%

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Survila¹,

Mockus²,

Kanapeckaitė³

et al. 2009

J Appl Electrochem

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“…In this case, sufficiently thin oxide layers were formed and it was possible to characterize the cathodic process quantitatively by equations of formal electrochemical kinetics. However, such a procedure failed when the surface layers were considerably thicker, as, e.g., in the case of the Cu|Cu(II), b-alanine system [2].…”

Section: Introductionmentioning

confidence: 98%

Oxide layers developed on copper electrodes in Cu(II) solutions containing ligands

Survila

Survilienė

Kanapeckaitė

et al. 2005

Journal of Electroanalytical Chemistry

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“…The most widely used surfactants are polyether‐based. This is attributed to their availability, suitability in improving Sn plating, and the resultant surface tension is closely related to hydrocarbon‐chain length (Survila et al , 2005; Survila and Bražinskienė, 2007; Survila, 2011). Fluorosurfactants are also particularly advantageous in electroplating due to their chemical stability, cost effectiveness and allows high operating temperature (Vittal et al , 2006; Low and Walsh, 2008b; Malik et al , 2011).…”

Section: Additivesmentioning

confidence: 99%

Electrodeposition of lead‐free solder alloys

Goh

Haseeb

Sabri

2013

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues.Design/methodology/approachThe paper reviews the available reports on the electrodeposition of tin (Sn)‐based solder systems and identifies the challenges in this area.FindingsCompositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near‐desired alloy composition. Acidic plating baths are preferred due to their compatibility with photoresists but oxidation of stannous ions causes poor bath stability. Antioxidants, reducing agents and low oxygen overpotential anodes can suppress the oxidation rate and increase the lifespan of plating baths. Apart from chelating agents and antioxidants, various categories of additives can be added to improve quality of deposits. Surfactants, grain refiners and brighteners are routinely used to obtain smooth, fine‐grained and bright deposits with good thermo‐mechanical properties.Originality/valueThe paper provides information on the key issues in electrodeposition of Pb‐free solder alloys. Possible measures to alleviate the issues are suggested so that the electrodeposition technique can be established for mass production of a wider range of solder alloys.

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Inhibition activity of ethyleneglycol and its oligomers on tin electrode

Cited by 14 publications

References 19 publications

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Codeposition of copper and tin from acid sulphate solutions containing polyether sintanol DS-10 and benzaldehyde

Oxide layers developed on copper electrodes in Cu(II) solutions containing ligands

Electrodeposition of lead‐free solder alloys

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