Infrared identification of internal overheating components inside an electric control cabinet by inverse heat transfer problem

Li, Yahui; Wang, Ye; Liu, Huikai; Gao, Yan; Kou, Wei

doi:10.1117/12.2072030

Cited by 3 publications

(1 citation statement)

References 1 publication

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“…40% of distribution system accidents are related to the temperature rise of the switch cabinet. If the equipment operates at a high temperature for a long time, the operation of the distribution system will no longer be stable, and overheating may lead to serious combustion accidents [16][17][18][19][20][21][22]. The failure rate of distribution system at all levels can be reduced effectively by exploring the change law of temperature rise of ECSC, and optimizing the design concept of the cooling system.…”

Section: Introductionmentioning

confidence: 99%

Heat Flow Field Analysis on Cooling System of Electrical Control Switch Cabinet

Guang-wen¹,

Sun²,

Xu³

2021

IJHT

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The failure rate of distribution system at all levels can be reduced effectively by exploring the change law of temperature rise of electrical control switch cabinet (ECSC), and optimizing the design concept of the cooling system. These efforts can significantly promote the coordinated development of grids at all levels. However, the existing studies rarely discuss the temperature rise law under external factors or non-rated conditions. The factors affecting temperature rise have not been fully considered, not to mention the correlations between these factors. Likewise, few scholars have tried to optimize the design of the cooling system. Therefore, this paper carries out a heat flow field analysis on the cooling system of ECSC. Firstly, the design idea of ECSC cooling system was explained, and the design steps of ECSC cooling were presented. Secondly, a mathematical model was established for the motion of ECSC thermal fluid, based on the laws of conservation of mass, momentum, and energy. Thirdly, a turbulence model and a porous media model were constructed for ECSC heat flow field analysis, after fully considering multiple factors: the compressibility of the fluid, the construction of a special yet feasible problem, the precision requirement, the computing capacity, and the time limit. Finally, the uniformity of the flow field was measured by parameters like mean speed, coefficient of speed fluctuation, and cloud map of speed, the results of ECSC heat flow field analysis were obtained, and useful suggestions were provided for structural optimization.

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Section: Introductionmentioning

confidence: 99%

Heat Flow Field Analysis on Cooling System of Electrical Control Switch Cabinet

Guang-wen¹,

Sun²,

Xu³

2021

IJHT

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Use of infrared thermography for the explicit heat flux estimation employing regularized measurements with truncated eigenfunction expansions

Sanches

Knupp

Stutz

et al. 2021

Thermal Science and Engineering Progress

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An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board

Huang,

Zhong

2024

MATH

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<abstract> <p>In this three-dimensional steady-state inverse heat transfer problem, we determine the magnitude of the spatially dependent volumetric heat source originating from multiple encapsulated chips mounted on a printed circuit board (PCB). Prior to the estimations, the functional form of the multiple heat sources is treated as unknown, leading to its classification as a function estimation challenge within the realm of inverse problems. The utilization of the conjugate gradient method (CGM) as an optimization tool is rooted in its distinct advantage of not requiring any a priori knowledge regarding the functional form of the unidentified quantities. Furthermore, the CGM empowers the simultaneous correction and estimation of multiple unknowns during each iteration, thereby ensuring the consistent possibility of precise estimates.</p> <p>To affirm the precision of the estimated heat source attributed to multiple chips, a series of numerical experiments were conducted. These experiments encompassed varying inlet air velocities and introduced measurement errors. Notably, the results revealed that meticulous measurements consistently yielded accurate heat generation assessments for the chips, regardless of the prevailing air velocity conditions. The findings underscored that the accuracy of chip heat generation estimates diminished as measurement errors escalated, predominantly due to the ill-posed nature inherent in the inverse problem.</p> </abstract>

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Infrared identification of internal overheating components inside an electric control cabinet by inverse heat transfer problem

Cited by 3 publications

References 1 publication

Heat Flow Field Analysis on Cooling System of Electrical Control Switch Cabinet

Heat Flow Field Analysis on Cooling System of Electrical Control Switch Cabinet

Use of infrared thermography for the explicit heat flux estimation employing regularized measurements with truncated eigenfunction expansions

An inverse problem to estimate simultaneously the heat source strength for multiple integrated circuit chips on a printed circuit board

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