Infrared heating in the technology of soldering components in electronics

Lanin, V. L.

doi:10.3103/s1068375507050134

Cited by 13 publications

(7 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Soldering achieves good electrical contact [ 84 ]. The integration of the electronics on to textile substrate by soldering can usually be achieved by direct contact or frictional soldering [ 85 ], hot air or thermal soldering [ 86 ], ultrasonic soldering [ 87 , 88 ], laser soldering [ 89 ], and infrared soldering [ 90 ] as shown in Figure 3 [ 91 ].…”

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

View full text Add to dashboard Cite

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

View full text Add to dashboard Cite

show abstract

“…Soldering achieves good electrical contact [78]. The integration of the electronics on to textile substrate by soldering can be usually achieved by direct contact or frictional soldering [79], hot air or thermal soldering [80], ultrasonic soldering [81,82] , laser soldering [83] and infrared soldering [84]. Mostly, for textile materials, thermal bonding and ultrasonic soldering have been used.…”

Section: Solderingmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

View full text Add to dashboard Cite

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

Section: Solderingmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

Simegnaw

Malengier

Gideon

et al. 2021

Preprint

View full text Add to dashboard Cite

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

Infrared heating in the technology of soldering components in electronics

Cited by 13 publications

References 0 publications

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-textile

Review on the Integration of Microelectronics for E-Textile

Contact Info

Product

Resources

About