Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Zhang, Zhe; Hu, Xiaowu; Jiang, Xiongxin; Li, Yulong

doi:10.1007/s11661-018-4983-7

Cited by 94 publications

(13 citation statements)

References 39 publications

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“…This may be ascribed to the growth of interfacial IMC being dominated by the inter-diffusion of the Sn and Cu atoms during the isothermal aging process. Cu atoms from the Cu substrate diffused to the Cu 3 Sn/Cu 6 Sn 5 interface, and the following reaction occurred: Cu 6 Sn 5 + 15Cu = 5Cu 3 Sn (reaction 1) [35]. Additionally, some Sn atoms may diffuse from the solder seam to the Cu 3 Sn/Cu interface, and the reaction of 3Cu + Sn = Cu 3 Sn (reaction 2) occurred [35].…”

Section: Interfacial Imc Evolution Of the Sn25ag07cu01re/cu Soldermentioning

confidence: 99%

“…Cu atoms from the Cu substrate diffused to the Cu 3 Sn/Cu 6 Sn 5 interface, and the following reaction occurred: Cu 6 Sn 5 + 15Cu = 5Cu 3 Sn (reaction 1) [35]. Additionally, some Sn atoms may diffuse from the solder seam to the Cu 3 Sn/Cu interface, and the reaction of 3Cu + Sn = Cu 3 Sn (reaction 2) occurred [35]. Therefore, the Cu 3 Sn layer grew to both sides, causing the Cu/Cu 3 Sn interface to move to the Cu substrate side and the Cu 6 Sn 5 /Cu 3 Sn interface to move to the Cu 6 Sn 5 side during isothermal aging.…”

Section: Interfacial Imc Evolution Of the Sn25ag07cu01re/cu Soldermentioning

confidence: 99%

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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao

Zhang

et al. 2020

Materials

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Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original single scallop-type Cu6Sn5 IMC gradually evolved into a planar double-layer IMC consisting of Cu6Sn5 and Cu3Sn IMCs with isothermal aging. In particular, the Cu3Sn IMC grew towards the Cu substrate and the solder seam sides; growth toward the Cu substrate side was dominant during the isothermal aging process. The growth of Cu3Sn IMC depended on the accumulated time at a certain temperature, where the growth rate of Cu3Sn was higher than that of Cu6Sn5. Additionally, the growth of the interfacial IMC was mainly controlled by bulk diffusion mechanism, where the activation energies of Cu6Sn5 and Cu3Sn were 74.7 and 86.6 kJ/mol, respectively. The growth rate of Cu3Sn was slightly faster than that of Cu6Sn5 during isothermal aging. With increasing isothermal aging time, the shear strength of the solder joints decreased and showed a linear relationship with the thickness of Cu3Sn. The fracture mechanism of the solder joints changed from ductile fracture to brittle fracture, and the fracture pathway transferred from the solder seam to the interfacial IMC layer.

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Section: Interfacial Imc Evolution Of the Sn25ag07cu01re/cu Soldermentioning

confidence: 99%

Section: Interfacial Imc Evolution Of the Sn25ag07cu01re/cu Soldermentioning

confidence: 99%

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao

Zhang

et al. 2020

Materials

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“…In the past, the tin-lead solder was commonly used due to its good wettability and low melting point [1][2][3][4][5], but due to the consideration of environmental protection, this toxicity solder was forbidden to use by the regulation of hazardous substances (RoHS) and gradually replaced by lead-free solders in modern electronics industries [6][7][8][9][10]. As a kind of conventional lead-free solder, the Sn-58Bi has drawn a great deal of attention in the field of research owing to its excellent properties, such as the relatively low melting point (138 °C), superior creep resistance and high tensile strength [11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn-58Bi/Cu-xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn-58Bi/Cu-10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0-5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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“…In this reaction, Ni 3 P layer (P-rich layer) is easy to form due to the depletion of Ni in the electroless Ni(P) layer. According to the reports by previous researches [20][21][22][23][24][25], Ni 3 (P) layer is easy to form voids and cracks, which can greatly degrade the reliability of solder joint.…”

Section: Introductionmentioning

confidence: 99%

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

et al. 2020

J Mater Sci: Mater Electron

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Coating at the interface of solder joint has a great impact on the growth behavior of intermetallic compounds (IMCs) and the mechanical properties. In this study, the sandwich structure samples of Cu/Sn3.0Ag0.5Cu/Cu solder joints with coatings of Ni(P) monolayer and dual Cu-Ni(P) layers on Cu substrate were designed to conduct the shear test. The mechanical strength, fracture modes, and fractographic morphologies of Sn3.0Ag0.5Cu/Cu, Sn3.0Ag0.5Cu/Ni(P)-Cu, and Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints reflowed at 280 °C for 10 min and then aged at 150 °C for up to 360 h were investigated. Experimental results show that the mechanical strength of Sn3.0Ag0.5Cu/Cu solder joints firstly increased because of the pinning effect of IMC, and then decreased due to the brittleness of excessive growth of IMC during solid-state aging processes. The Sn3.0Ag0.5Cu/Cu solder joints presented ductile fracture, mixed fracture, and brittle fracture modes during shear testing processes. The shear strength of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints decreased to about 17 MPa after 120 h thermal aging. At the same time, the shear failure mode of Sn3.0Ag0.5Cu/Ni(P)-Cu solder joints changed from the ductile dominant fracture to the brittle dominant fracture. The shear strength of Sn3.0Ag0.5Cu/Cu-Ni(P)-Cu solder joints remained approximate 21 MPa and the fractured position always occurred inside the IMC layer regardless of aging time.

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Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints

Cited by 94 publications

References 39 publications

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

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