2009
DOI: 10.1016/s1003-6326(08)60291-5
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Influences of material parameters on deep drawing of thin-walled hemispheric surface part

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Cited by 21 publications
(7 citation statements)
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“…It was observed that proper selection of material plays a significant role in the successful deep drawing of a component. Gao et al 20 investigated the influence of material parameters such as yield stress, hardening exponent and elastic modulus on deep drawing of a thin-walled hemispheric surface part by developing a three-dimensional FE model. It was observed that the effect of hardening exponent, yield stress, equivalent strain and punch force had more influence on thickness variation.…”
Section: Thinning Effectmentioning
confidence: 99%
“…It was observed that proper selection of material plays a significant role in the successful deep drawing of a component. Gao et al 20 investigated the influence of material parameters such as yield stress, hardening exponent and elastic modulus on deep drawing of a thin-walled hemispheric surface part by developing a three-dimensional FE model. It was observed that the effect of hardening exponent, yield stress, equivalent strain and punch force had more influence on thickness variation.…”
Section: Thinning Effectmentioning
confidence: 99%
“…GAO En-zhi (2009) at al. [7] researched the influences of material parameters such as hardening exponent n, yield stress σ s , and elastic modulus E on the process by a 3D finite element model simulation. They developed a model of a thin-walled hemispheric surface part.…”
Section: Introductionmentioning
confidence: 99%
“…These work parameters must be known regardless of the finite element program used so that the simulation of the deep drawing process is the same as the experiments. Modern material resistance calculations, even when applied to classical problems of elasticity or plasticity theory, can not be conceived without the use of numerical calculation methods [19,20]. Therefore, this situation is a direct consequence of advances in the field of computers, both in hardware and software.…”
Section: Introductionmentioning
confidence: 99%