Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
Li Liu,
Chunhua Zhang,
Ping Hu
et al.
Abstract:Purpose
This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.
Design/methodology/approach
A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.
Findings
It was found in this paper that the moisture diffusion … Show more
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