Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints

Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin

doi:10.1007/s10854-020-04035-w

Cited by 9 publications

(7 citation statements)

References 55 publications

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“…Similarly, the figure of merit, zT , of the material is also modified such that ZT Device = zT Material · L /( L + 2ρ c · σ), where L and σ are the length and the electrical conductivity of the thermoelectric leg, respectively, and ρ c is the electrical contact resistivity. Contributing to lower η values are such items as severe interface elemental diffusion or reaction and mismatch in work functions (WF) or in the thermal expansion coefficients (CTE). − Selecting alloy electrodes or adding barrier materials that can effectively inhibit the diffusion of interface elements or reduce the degree of mismatch for CTE and WF are currently utilized in optimization methods. ,− …”

Section: Introductionmentioning

confidence: 99%

Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

Wang

Chen

Jiang

et al. 2022

ACS Appl. Mater. Interfaces

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The Zintl compound, n-type Mg3Sb2, has been extensively investigated as a promising thermoelectric material. However, performance degradation caused by the loss of Mg element during device preparation and service is a main disadvantage in its utilization in thermoelectric devices. To suppress volatilization, diffusion, or reaction of Mg, we designed a graded concentration junction to control the interfacial elemental diffusion and improve the stability of the thermoelectric joint. We utilized the reaction product at the Ni/Mg3.2Sb2Y0.05 interface, the phase Mg4.3Sb3Ni, as a barrier layer material, and prepared Mg4.3Sb3Ni/Mg3.2Sb2Y0.05/Mg4.3Sb3Ni junctions. The results show that the interface behavior of the thermoelectric junction is optimized by the gradation of elemental concentration, thermal expansion coefficient, and work function. The Mg4.3Sb3Ni/Mg3.2Sb2Y0.05/Mg4.3Sb3Ni single-leg device showed high thermal stability at 673 K for 20 days, the contact resistance was stable at around 10 μΩ cm2, and the shear strength was maintained at about 20 MPa. The conversion efficiency of its single-leg device maintains nearly 90% of the best performance after aging at 673 K for 20 days.

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Section: Introductionmentioning

confidence: 99%

Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

Wang

Chen

Jiang

et al. 2022

ACS Appl. Mater. Interfaces

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“…A Ni-coated Bi 2 Te 3 specimen first sputtered a thin Au layer, and the interface between it and SAC305 exhibited lower electrical resistance, because the multiple Ni/Au intermediate layers efficiently inhibited growth of the IMC phase. 29 Different from Ni/Au barriers, for the Bi 2 Te 3 /Ti/ Au/Ag structure, the Ti layer bonded well with Bi 2 Te 3 , and the Au layer bonded well with an Ag electrode. After annealing at 250 °C for 200 h, there was no interdiffusion among them, as shown in Figure 6.…”

Section: Other Metal Diffusion-barrier Layersmentioning

confidence: 93%

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

Yang

Sheng

et al. 2023

ACS Appl. Mater. Interfaces

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Intensive efforts have been conducted to realize the reliable interfacial joining of thermoelectric materials and electrode materials with low interfacial contact resistance, which is an essential step to make thermoelectric materials into thermoelectric devices for industrial application. In this review, the roles of structural integrity, interdiffusion, and contact resistance in long-term reliabilities of thermoelectric modules are outlined first. Then interfacial reactions of near-room-temperature Bi2Te3-based thermoelectric materials and various electrode materials are reviewed comprehensively. We also summarized the joining behavior of the mid-temperature PbTe-based thermoelectric materials and commonly used electrode materials. Subsequently, for other thermoelectric materials systems, i.e., SiGe, CoSb3, and Mg3Sb2, previous attempts to join with some electrode materials are also recapitulated. Finally, some future prospects to further improve the joint reliability in thermoelectric device manufacturing are proposed. We believe that this review will provide guidance for preparing thermoelectric devices and optimizing thermoelectric device design.

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“…This can be accompanied by the formation of solid solutions or intermetallic compounds at contact interface, which have a lower value of electrical conductivity and mechanical strength. Therefore, in a number of cases, it is necessary to organize a diffusion barrier between the substrate and the deposited contact layer [6,11,13,14,[30][31][32].…”

Section: Factors Determining the Adhesive Strength Of Film Coatingsmentioning

confidence: 99%

XVII Interstate Conference Thermoelectrics and Their Applications --- 2021" (ISCTA 2021 St. Petersburg, September 13-16, 2021 Obtaining and investigation of ohmic contacts with high adhesion to thermoelements

et al. 2022

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The factors determining the adhesive strength of film coatings are considered. The functions of contacts in thermoelements used in a wide temperature range were determined. It was established that the adhesive strength of contact is a limiting factor in the mechanical strength of a thermoelement. A method of vacuum sputtering of thin-film contacts was proposed, including the surface treatment of samples of thermoelectric materials. The presence of a transition layer in the area of the metal-thermoelectric material contact, formed during the interaction of the metal with elements of the thermoelectric material, was established. The dependence of the adhesive strength of film contact on roughness of surface on which they formed was established. Thermal stable contacts for thermoelements with low resistivity of the order of 10-9 Ω·m2 and high adhesion strength of at least 12 MPa were obtained by ion-plasma sputtering. Keywords: thermoelements, contacts, thin films, adhesion, contact resistance.

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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints

Cited by 9 publications

References 55 publications

Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

XVII Interstate Conference Thermoelectrics and Their Applications --- 2021" (ISCTA 2021 St. Petersburg, September 13-16, 2021 Obtaining and investigation of ohmic contacts with high adhesion to thermoelements

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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints

Cited by 9 publications

References 55 publications

Suppression of Interfacial Diffusion in Mg3Sb2 Thermoelectric Materials through an Mg4.3Sb3Ni/Mg3.2Sb2Y0.05/Mg4.3Sb3Ni-Graded Structure

Suppression of Interfacial Diffusion in Mg3Sb2 Thermoelectric Materials through an Mg4.3Sb3Ni/Mg3.2Sb2Y0.05/Mg4.3Sb3Ni-Graded Structure

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

XVII Interstate Conference Thermoelectrics and Their Applications --- 2021&quot; (ISCTA 2021 St. Petersburg, September 13-16, 2021 Obtaining and investigation of ohmic contacts with high adhesion to thermoelements

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Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

Suppression of Interfacial Diffusion in Mg₃Sb₂ Thermoelectric Materials through an Mg_4.3Sb₃Ni/Mg_3.2Sb₂Y_0.05/Mg_4.3Sb₃Ni-Graded Structure

XVII Interstate Conference Thermoelectrics and Their Applications --- 2021" (ISCTA 2021 St. Petersburg, September 13-16, 2021 Obtaining and investigation of ohmic contacts with high adhesion to thermoelements