In modern Nb 3 Sn wires there is a fundamental compromise to be made between optimizing the intrinsic properties associated with the superfluid density in the A15 phase (e.g. T c , H c , H c2 , all of which are composition dependent), maximizing the quantity of A15 that can be formed from a given mixture of Nb, Sn and Cu, minimizing the A15 composition gradients within each sub-element, while at the same time generating a high vortex pinning critical current density, J c , by maximizing the grain boundary density with the additional constraint of maintaining the RRR of the Cu stabilizer above 100. Here we study these factors in a Ta-alloyed Restacked-Rod-Process (RRP ® ) wire with ~70 m diameter sub-elements. Consistent with many earlier studies, maximum non-Cu J c (12 T, 4.2 K) requires preventing A15 grain growth, rather than by optimizing the superfluid density. In wires optimized for 12 T, 4.2 K performance, about 60% of the non-Cu cross-section is A15, 35% residual Cu and Sn core, and only 5% a residual Nb-7.5wt.%Ta diffusion barrier. The specific heat and chemical analyses show that in this 60% A15 fraction there is a wide range of T c and chemical composition that does diminish for higher heat treatment temperatures, which, however, are impractical because of the strong RRR degradation that occurs when only about 2% of the A15 reaction front breaches the diffusion barrier. As this kind of Nb 3 Sn conductor design is being developed for sub-elements about half the present size, it is clear that better barriers are essential to allowing higher temperature reactions with better intrinsic A15 properties. We present here multiple and detailed intrinsic and extrinsic evaluations because we believe that only such broad and quantitative descriptions are capable of accurately tracking the limitations of individual conductor designs where optimization will always be a compromise between inherently conflicting goals.
| P a g eRestack-Process (RRP ® ) design can easily provide non-Cu J c (12 T, 4.2 K) > 3000 A/mm 2 but struggle to produce long-piece length conductors with d eff < 35-40 m [4], while PIT conductors struggle to produce non-Cu J c (12 T, 4.2 K) exceeding 2500 A/mm 2 , although they do offer a slightly smaller sub-element size [5]. The present paper seeks to understand the way that a balance of intrinsic (T c , H c2 , Sn content, …) and extrinsic (partition of real estate between Sn, Cu, Nb(Ta) and diffusion barrier, A15 grain boundary density, J c , …) factors controls the properties of a modern high performance RRP ® conductor designed for demanding accelerator use, while a subsequent paper will explore some aspects of the same issue for recent PIT conductors.The further development of high performance Nb 3 Sn should be enabled by a more detailed understanding of the A15 composition, grain morphology, wire structure and strain that until now has been evaluated in a mostly ad hoc, empirical way. In fact the optimization of modern Nb 3 Sn conductors in terms of their Cu:Nb:Sn ratio, effectiveness of dopi...