Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Song, Jenn‐Ming; Liu, Yao-Ren; Lai, Yi‐Shao; Chiu, Ying-Ta; Lee, Ning-Cheng

doi:10.1016/j.microrel.2011.09.003

Cited by 21 publications

(8 citation statements)

References 33 publications

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“…Lee et al [14] also investigated this property and found similar results. Other researchers [15] have shown that the low silver content of manganese alloy increases the IMC layer thickness, however, after longer aging cycles, the thickness increases slightly and the metal structure remains finer, resulting in relative increased shear strength. SAC0307Mn0.7…”

Section: Resultsmentioning

confidence: 91%

Reliability Tests on SAC-xMn Solder Alloys

Szurdan

Medgyes

Mende

et al. 2019

2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Different Sn based micro-alloyed solder alloys with manganese content were developed for the electronic industry as a possible cost-effective candidates. The commonly used SnAg3Cu0.5 (SAC305) lead-free solder alloy applied as a reference. As a first step, various technological parameters tested from the solder alloy-manufacturing point of view. During the reliability investigations of the solder alloys, Vickers hardness, tensile strength and shear force tests were carried out. The results show that Mn content SAC alloys are useful in the electronics technology especially in those fields, where the high reliability is not required.

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Section: Resultsmentioning

confidence: 91%

Reliability Tests on SAC-xMn Solder Alloys

Szurdan

Medgyes

Mende

et al. 2019

2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME)

View full text Add to dashboard Cite

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“…An Instron micro-impact test apparatus was applied for BIT testing. The principle and practice of BIT are described in detail elsewhere [1,2,[16][17][18]. A striker was ejected upon the release of an air-compressed spring of which the velocity (V i ) was 0.6 m/s in this study.…”

Section: Methodsmentioning

confidence: 99%

“…In order to study the board-level solder joint reliability, a ball impact test (BIT) suffering high strain rate deformation was developed. Similar to a board-level drop test, BIT usually gives rise to brittle fracture at the interfacial IMCs [1,2].…”

Section: Introductionmentioning

confidence: 99%

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

et al. 2020

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This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained through the design of solder alloy/substrate material combinations. Nanoindentation was applied to investigate the mechanical properties of IMCs, including hardness, Young’s modulus, work hardening exponent, yield strength, and plastic ability. Experimental results suggest that nanoindentation responses of IMCs at joint interface definitely dominates joint impact performance. The greater the plastic ability the interfacial IMC exhibits, the superior impact energy the solder joints possess. The concept of mechanical and geometrical discontinuities was also proposed to explain brittle fracture of the solder joints with bi-layer interfacial IMCs subject to impact load.

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“…They proved that these metals can increase the drop shock reliability of lead-free solder joints. Song et al also confirmed by ball impact testing the improved mechanical behavior of alloys with manganese dopants [ 25 ]. Lin et al measured the elongation and Young’s modulus of SAC solders alloyed with manganese and titanium [ 23 ] and showed an increase in the elongation and a decrease in the Young’s modulus.…”

Section: Introductionmentioning

confidence: 91%

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

et al. 2020

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Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20–25 N) compared with the SAC305 alloy (27–35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder–substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

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Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Cited by 21 publications

References 33 publications

Reliability Tests on SAC-xMn Solder Alloys

Reliability Tests on SAC-xMn Solder Alloys

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

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