2006
DOI: 10.1007/s10854-006-0024-1
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Influence of titanium on the formation of a “barrier” layer during joining an A1N ceramic with copper by the CDB technique

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Cited by 19 publications
(12 citation statements)
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“…1,2,10-13 Meanwhile, other critical developments in the module construction, such as in the area of materials junctions (ceramicmetal-TE material, barriers and bonders), are ongoing, [14][15][16] including quality measurements of thermoelectric-thermoelectric (TE-TE) junction in cascaded modules. 17,18 The lifetime and the reliability of thermoelectric modules are also important.…”
Section: 3mentioning
confidence: 99%
“…1,2,10-13 Meanwhile, other critical developments in the module construction, such as in the area of materials junctions (ceramicmetal-TE material, barriers and bonders), are ongoing, [14][15][16] including quality measurements of thermoelectric-thermoelectric (TE-TE) junction in cascaded modules. 17,18 The lifetime and the reliability of thermoelectric modules are also important.…”
Section: 3mentioning
confidence: 99%
“…Corundum is now the third among the most often used dielectrics (after SiO 2 and SiN 4 ). On the other hand, the choice of titanium as the coating material, detonation-sprayed on the ceramic, was based on literature reports [21][22][23][24] which describe titanium as the material that actively enhances the wetting of ceramics by metals and facilitates the formation of the joint even when it is only an alloying additive. In view of the strong chemical affinity of titanium to oxygen and aluminum (the basic components of the Al 2 O 3 ceramic), new compounds of the Ti-O and Ti-Al systems are formed.…”
Section: Substrate and Coating Materialsmentioning
confidence: 99%
“…This method is only briefly mentioned in some references (Raebel et al 1990;Ko 1998;Dearnaley and Arps 2006). Ion implantation is a very popular method for the modification of other materials (Jagielski 2005;Jagielski et al 2006), such as metals and alloys (Barlak et al 2014), ceramics (Piekoszewski et al 2004;Olesińska et al 2006;Barlak et al 2007b), composites (Sheikh-Ahmad and Bailey 1999), and semiconductors (Werner et al 2013).…”
Section: Introductionmentioning
confidence: 99%