Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Abdulhamid, Mohd F.; Basaran, Cemal

doi:10.1115/1.3068296

Cited by 34 publications

(14 citation statements)

References 25 publications

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“…Disintegration of IMC on hot side was studied in depth by Abdulhamid and Basaran [7]. This experiment confinns previous findings.…”

Section: 5supporting

confidence: 80%

“…The delamination and the absence of Cll(;Sn5 IMC layer are due to the disintegration of the Cll(;Sn5 IMC into Cu and Sn atoms. 7 UBM delamination on top of solder joint 5 when stressed at -20°C ambient temperature. At -30°C ambient temperature, solder joint 4 shows some Cll(;Sns IMC at the hot (top) side, but not as thick as initial one.…”

Section: Metallurgical Analysismentioning

confidence: 99%

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Low temperature electromigration and thermomigration in lead-free solder joints

Hamid

Basaran

2008

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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High current density and high temperature gradient are major reliability concern for next generation high density power electronics. High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads were conducted at -20°C, -30°C, -40°C and -50°C ambient temperatures. The time to failure (TTF) shows that solder joints with NiAu coated Cu pads last longer. Results also indicates TTF plot shows that TTF rate increases exponentially when the solder joint temperature is higher than 64% of its melting temperature, and decreases exponentially reaching the maximum lifetime when the temperature is below this threshold temperature. The mass transport activation energy, Eo was determined using the test data and it was found to be 2.67 ± 0. 05 and 3.65 ± 0. 13 eV for coated and non-coated solder joints, respectively. These values are indicative of the dominant diffuion mechanism during the experiment. It was discovered that the thermomigration driving force was as high as electromigration driving force.

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“…Disintegration of IMC on hot side was studied in depth by Abdulhamid and Basaran [7]. This experiment confinns previous findings.…”

Section: 5supporting

confidence: 80%

Section: Metallurgical Analysismentioning

confidence: 99%

Low temperature electromigration and thermomigration in lead-free solder joints

Hamid

Basaran

2008

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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“…The microstructural evolution in Cu/Sn4Ag0.5Cu/Cu solder interconnects has been studied under a thermal gradient of 1000-1200°C/cm [121,122]. It has been found that the two major microstructural differences between TM and isothermal samples were the lack of a Cu 3 Sn layer at both the higher and lower temperature sides, and the thinning of the Cu 6 Sn 5 layer at the higher temperature side for the TM samples.…”

Section: Tm In Sn-based Lead-free Solder Interconnectsmentioning

confidence: 99%

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Chan

Yang

2010

Progress in Materials Science

250

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“…Otherwise, the thickness of Cu 3 Sn seemed no change at both the cold end and the hot end. This is because the required Cu mass concentration is not enough to form Cu 3 Sn [12].…”

Section: Effect Of Tm On Interfacial Imcs Morphologiesmentioning

confidence: 97%

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

Wei¹,

Du²,

Jia³

et al. 2015

J Mater Sci: Mater Electron

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The growth behaviors of the interfacial intermetallic compounds (IMCs) in Cu/Sn/Cu and Cu/Sn0.7Cu/ Cu solder joints were systematically investigated under a temperature gradient of 1046°C/cm for 250, 500, and 750 h, respectively. Thermomigration (TM) caused the interfacial IMCs accumulation at the cold end and disintegration at the hot end, and the evolution rate in Cu/ Sn0.7Cu/Cu solder joint was faster than that in Cu/Sn/Cu solder joint. In addition, it was observed that both Cu 6 Sn 5 and Cu 3 Sn IMC at the cold end grew with TM time in Cu/ Sn0.7Cu/Cu solder joint, and the Cu 3 Sn at the hot end grew faster than at the cold end. However, no obvious change was observed in Cu/Sn/Cu solder joint. Therefore, we conclude that Cu/Sn0.7Cu/Cu solder joint has a more serious TM damage compared with Cu/Sn/Cu solder joint. The microhardness detection indicates that TM can cause microhardness reduction in the two solders, and the microhardness gradually increased from the hot end to the cold end, which was attributed to grain coarsening and higher vacancy concentration at the hot end.

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Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Cited by 34 publications

References 25 publications

Low temperature electromigration and thermomigration in lead-free solder joints

Low temperature electromigration and thermomigration in lead-free solder joints

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

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