Influence of the processing conditions on the structural properties of ZnO layers obtained by PECVD

Kitova, S.; Danev, G.

doi:10.1088/1742-6596/253/1/012031

Cited by 9 publications

(8 citation statements)

References 9 publications

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“…al. [14] studied the RF plasma treatment of polycarbonate substrates and found that all RF plasma treatments led to an increase in the polar component of PC due to an increased hydrogen bonding ability. Sira et.…”

Section: Introductionmentioning

confidence: 99%

Surface free energy analysis for bipolar pulsed argon plasma treated polymer films

Pelagade

Singh

Shah

et al. 2010

J. Phys.: Conf. Ser.

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Section: Introductionmentioning

confidence: 99%

Surface free energy analysis for bipolar pulsed argon plasma treated polymer films

Pelagade

Singh

Shah

et al. 2010

J. Phys.: Conf. Ser.

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“…From Refs. [9,29], it is known that many surface characteristics (chemical activity, wettability, adhesion ability) are closely linked with the free surface energy T . Speaking simply, the higher T values correspond to "active" surface while the lower T allows one to speak about an "inert" surface.…”

Section: Surface Characterizationmentioning

confidence: 99%

Silicon Surface Modification Using C4F8+O2 Plasma for Nano-Imprint Lithography

Lee¹,

Efremov²,

Gy³

et al. 2015

j nanosci nanotechnol

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The investigation of C4F8+O2 feed gas composition on both plasma parameters and plasma treated silicon surface characteristics was carried out. The combination of plasma diagnostics by Langmuir probes and plasma modeling indicated that an increase in O2 mixing ratio results in monotonically decreasing densities of CF(x) (x = 1-3) radicals as well as in non-monotonic behavior of F atom density. The surface characterization by X-ray photoelectron spectroscopy and contact angle measurements showed that the C4F8+O2 mixtures with less than 60% 02 result in modification of Si surfaces due to the deposition of the FC polymer films while the change of O2 mixing ratio in the range of 30%-60% provides an effective adjustment of the surface characteristics such as surface energy, contact angle, etc.

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“…The effect of plasma treatment depends on a verity of parameters such as type of plasma (DC, radio frequency (RF) or microwave (MW)), the plasma power, the pressure of the working gas, flow rate or gas mixture (type of working gas), as well as treatment time [15]. In the present study, PS films were treated by DC glow discharge plasma with two different working gases (Ar and N 2 ) at low pressure to improve the hydrophilicity and antibacterial activity properties of the films.…”

Section: Introductionmentioning

confidence: 99%

A Comparative Study of Surface Modification of PS Films Using DC Glow Discharge Plasma in N2 and Ar

Farag

2019

Arab Journal of Nuclear Sciences and Applications

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In this paper, the polystyrene (PS) film surface was treated using DC glow discharge nitrogen (N 2) and argon (Ar) plasma to improve the wettability and antibacterial properties. The untreated and plasma treated surfaces were characterized by contact angle, FTIR, XRD and SEM analysis. The antibacterial activity of untreated and plasma treated PS films was evaluated using optical density (OD) technique against Staphylococcus aureus bacteria. The results of the PS film surface treated in both N 2 and Ar showed a noticeable increase in the wettability due to the increase in the roughness and the introduction of oxygen-containing polar groups as corroborated with SEM, weight loss calculations and FTIR spectra. The results of antibacterial activity showed that the treated samples inhibit the bacterial growth. The Ar treatment created more oxygen-containing polar groups and increase roughness on the PS film surface and extensively modified the polymer surface than the N 2 treatment.

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Influence of the processing conditions on the structural properties of ZnO layers obtained by PECVD

Cited by 9 publications

References 9 publications

Surface free energy analysis for bipolar pulsed argon plasma treated polymer films

Surface free energy analysis for bipolar pulsed argon plasma treated polymer films

Silicon Surface Modification Using C<SUB>4</SUB>F<SUB>8</SUB>+O<SUB>2</SUB> Plasma for Nano-Imprint Lithography

A Comparative Study of Surface Modification of PS Films Using DC Glow Discharge Plasma in N2 and Ar

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