2017
DOI: 10.1002/pip.2953
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Influence of the precursor layer composition and deposition processes on the electronic quality of liquid phase crystallized silicon absorbers

Abstract: Liquid phase crystallization using line-shaped energy sources such as CW-diode lasers or electron beams has proven to form mc-Si layers on borosilicate or borosilicate/aluminosilicate glass that exhibit wafer equivalent grain sizes and electronic quality. In this work, we characterize the impact of the employed dielectric interlayer stack sandwiched between glass and absorber on the electronic quality. For this purpose, we investigate a large variety of test cell results achieved in the past on different inter… Show more

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Cited by 8 publications
(11 citation statements)
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“…An increase in bulk lifetime by a factor of 2-3 opens the way towards open circuit voltages up to 660 mV -670 mV and higher. The bulk quality itself can be enhanced by advanced crystallization resulting in preferential orientation and a reduction in recombinationactive grain boundaries [Kühnapfel15] or by altering the absorber deposition process as described in [Amkreutz17]. Furthermore, gettering techniques that are regularly used for multicrystalline wafers can be adapted to LPC-Si to reduce the impurity related recombination.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…An increase in bulk lifetime by a factor of 2-3 opens the way towards open circuit voltages up to 660 mV -670 mV and higher. The bulk quality itself can be enhanced by advanced crystallization resulting in preferential orientation and a reduction in recombinationactive grain boundaries [Kühnapfel15] or by altering the absorber deposition process as described in [Amkreutz17]. Furthermore, gettering techniques that are regularly used for multicrystalline wafers can be adapted to LPC-Si to reduce the impurity related recombination.…”
Section: Discussionmentioning
confidence: 99%
“…As for BSF passivation this defect layer could have its physical representation in inhomogeneous layer growth of the a-Si:H(i) layer due to surface morphology or insufficient cleaning of the silicon surface before deposition. Another cause for imperfections at the interface could be the incorporation and segregation of carbon and oxygen related impurities [Becker13,Amkreutz17]. However, as for the current density the improvement of the bulk quality promises a significant increase in open circuit voltage towards 660 mV -670 mV.…”
Section: Short Circuit Current Density and Open Circuit Voltagementioning
confidence: 99%
“…The high defect state density with O/N IL stack is not desirable, since it makes S eff,front very sensitive to variations in Q IL,eff . Furthermore, it is likely that SiN x layers that are in direct contact to silicon during the crystallization process are thermally unstable . The O/N/O stack provides a lower defect sate density at the front‐side interface.…”
Section: Resultsmentioning
confidence: 99%
“…The layer stack simultaneously served as a diffusion barrier, antireflection coating and as a passivation layer. Further details on the development and deposition process of the intermediate layer stack are described in literature [16]. With the intermediate layer deposition completed we then applied the silicon absorber layer by high-rate electron beam evaporation.…”
Section: Methodsmentioning
confidence: 99%