Influence of the electron mean free path on the resistivity of thin metal films

Zhang, W.; Brongersma, Sywert; Richard, Olivier; Brijs, Bert; Palmans, Roger; Froyen, Ludo; Maex, Karen

doi:10.1016/j.mee.2004.07.041

Cited by 198 publications

(120 citation statements)

References 12 publications

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“…The strain e is well-known due to the high resolution of the nanoindenter system. The conductivity q, however, may deviate from the bulk value q Ag ¼ 1:59 Â 10 À8 X m 26 and the coating thickness t is a nominal, not measured, value. We thus multiply Eq.…”

Section: Effect Of Coating Thicknessmentioning

confidence: 94%

“…27 This effect is significant when the film thickness or grain size approaches the electron mean free path (EMFP), which is 52 nm for bulk silver. 26 However, surface and grain boundary scattering limited resistivity can only account for a twofold increase of the resistivity at room temperature. 26 Therefore, other non-idealities must also be considered.…”

Section: Effect Of Coating Thicknessmentioning

confidence: 99%

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Electromechanical characterization of individual micron-sized metal coated polymer particles

Bazilchuk

Pettersen

et al. 2016

Journal of Applied Physics

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Micron-sized polymer particles with nanoscale metal coatings are essential in conductive adhesives for electronics assembly. The particles function in a compressed state in the adhesives. The link between mechanical properties and electrical conductivity is thus of the utmost importance in the formation of good electrical contact. A custom flat punch set-up based on nanoindentation has been developed to simultaneously deform and electrically probe individual particles. The set-up has a sufficiently low internal resistance to allow the measurement of sub-Ohm contact resistances. Additionally, the set-up can capture mechanical failure of the particles. Combining this data yields a fundamental understanding of contact behavior. We demonstrate that this method can clearly distinguish between particles of different sizes, with different thicknesses of metal coating, and different metallization schemes. The technique provides good repeatability and physical insight into the behavior of these particles that can guide adhesive design and the optimization of bonding processes.

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Section: Effect Of Coating Thicknessmentioning

confidence: 94%

Section: Effect Of Coating Thicknessmentioning

confidence: 99%

Electromechanical characterization of individual micron-sized metal coated polymer particles

Bazilchuk

Pettersen

et al. 2016

Journal of Applied Physics

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show abstract

“…Therefore, the thermal conductivity and diffusivity are dominated by the scattering process of conducting electrons. At room temperature, the electron mean free path of Ag is 52 nm (Zhang et al 2004). Although the average grain size obtained from XRD measurements is 4 times the mean free path of the electron, it was reported that the grain size of electrodeposited silver NW could vary from ~10 to ~200 nm (Kazeminezhad et al 2007).…”

Section: Nanowire-polymer Composite As Timmentioning

confidence: 98%

Nanowire-Polymer Nanocomposites as Thermal Interface Material

Razeeb¹,

Dalton²

2011

Advances in Nanocomposites - Synthesis, Characterization and Industrial Applications

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“…In general work done on the scattering in thin metal films is done by looking at the Mayadas-Shatzkes (MS) and Fuchs-Sondheimer (FS) models of scattering in metals which provides understanding of the elastic scattering in metals but this beyond the scope of this work [66,67,68,69,70].…”

Section: Elastic Scatteringmentioning

confidence: 99%

Nanoscale Schottky barrier visualization utilizing computational modeling and ballistic electron emission microscopy

Nolting

Durcan

Gassner

et al. 2018

Journal of Applied Physics

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The electrostatic barrier at a metal semiconductor interface is visualized using nanoscale spatial and meV energetic resolution. A combination of Schottky barrier mapping with ballistic electron emission microscopy and computational modeling enables extraction of the barrier heights, the hot electron scattering, and the presence of localized charges at the interface from the histograms of the spectra thresholds. Several metal semiconductor interfaces are investigated including W/Si(001) using two different deposition techniques, Cr/Si(001), and mixed Au-Ag/Si(001). The findings demonstrate the ability to detect the effects of partial silicide formation in the W and Cr samples and the presence of two barrier heights in intermixed Au/Ag films upon the electrostatic barrier of a buried interface with nanoscale resolution. This has potential to transform the fundamental understanding of the relationship between electrostatic uniformity and interface structure for technologically important metal semiconductor interfaces.

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Influence of the electron mean free path on the resistivity of thin metal films

Cited by 198 publications

References 12 publications

Electromechanical characterization of individual micron-sized metal coated polymer particles

Electromechanical characterization of individual micron-sized metal coated polymer particles

Nanowire-Polymer Nanocomposites as Thermal Interface Material

Nanoscale Schottky barrier visualization utilizing computational modeling and ballistic electron emission microscopy

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