2016
DOI: 10.1016/j.rinp.2016.11.015
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Influence of the acceptor roughness on the aspect ratio of silver paste lines printed by laser-induced forward transfer

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Cited by 4 publications
(4 citation statements)
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“…The adhesion force F a was enhanced with the wetting process of silver paste filling onto silicon wafer. A high mechanical interlocking was formed between the silver paste and acceptor, which favored the formation of the stable bridge [16]. After contact, the bubble began to deflate as the difference between internal and external pressure decreased.…”
Section: Formation Of Single and Double Peaksmentioning
confidence: 99%
“…The adhesion force F a was enhanced with the wetting process of silver paste filling onto silicon wafer. A high mechanical interlocking was formed between the silver paste and acceptor, which favored the formation of the stable bridge [16]. After contact, the bubble began to deflate as the difference between internal and external pressure decreased.…”
Section: Formation Of Single and Double Peaksmentioning
confidence: 99%
“…The acceptor is the surface on which the fluid is deposited on the transference. Its characterization is made through its wettability and its roughness, but both parameters are typically integrated into the contact angle between the material transferred and the surface (Chen, Y. et al, 2016;Canteli et al, 2019). Other parameters may modify the characteristics of this layer, such as its permeability (Alloncle et al, 2012), but its relevance is lesser compared to those of the two first ones.…”
Section: Acceptormentioning
confidence: 99%
“…In the simplest approaches to LIFT, the acceptor substrate is just a glass slide (Fardel, Nagel, Nüesch et al, 2007;Munoz-Martin et al, 2016). Other studied substrates are coated glass slides (Fardel, Nagel, Nüesch et al, 2007), ceramic materials (Schultze and Wagner, 1991), a silicon wafer -commonly used for electronics and photovoltaics applications- (Munoz-Martin et al, 2017), or even flexible substrates (Chen, Y., Munoz-Martin et al, 2016;Sood et al, 2018;Bian et al, 2019;Han et al, 2019). LIFT techniques do not need a uniform acceptor, as other printing techniques do, so they can be used to transfer materials onto planar and non-planar substrates (Fitz-Gerald, Piqué, Auyeung et al, 2000).…”
Section: Acceptormentioning
confidence: 99%
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