Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Yuichi; Kariya, Yoshiharu; Watanabe, Hirohiko; Hokazono, Hiroaki

doi:10.1007/s11664-017-5804-2

Cited by 8 publications

(7 citation statements)

References 25 publications

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“…7 shows qualitative Figure 8 shows three stress-strain diagrams of miniature size specimens at 233 K. Stress drops were observed in SAC305-1Bi, -2Bi and -3Bi between the initial stage of the test and fracture. Although the similar phenomenon has been reported in the tensile test of single crystal of Bi at 298 K, 14) there has been no report on SnAgCuBi solder. Compared to Figs.…”

Section: Grain Map Analysissupporting

confidence: 67%

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

et al. 2019

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In order to examine the effect of the Bi addition on tensile properties of SnAgCu solder at low temperatures, stress-strain diagrams were acquired by tensile tests at 233 K using miniature size specimens. Stress drops were observed in the stress-strain diagram of SnAgCuBi solder before it lead to a break. Similar phenomenon did not observed in the SnAgCu solder. The stress drops was exceptionally sharp in the SnAgCu solder with added 3 mass% Bi, compared to the solder with added 1 or 2 mass% Bi. The mode of the stress drop is depended on twin deformation. On the contrary, similar stress drop phenomenon was not observed in any stress-strain diagrams at 298 K. From the results of grain map analysis, it was found that many twin deformations occur in the specimen in which exceptional sharp stress drops appear in the stress-strain diagram.

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Section: Grain Map Analysissupporting

confidence: 67%

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

et al. 2019

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“…Under the same strain amplitude, the mobility of dislocation decreases and the twinning deformation increases with temperature decrease. The strain concentration zone is more prominent when it is tested at 20°C compared with at 550°C, because of the reduced number of slip systems operating at the lower temperature, which results in dislocations being readily blocked at obstacles and twinning occurring [13,14]. Finally, a relatively flat and straight crack in samples tested at 550°C and a zigzag crack in samples tested at 20°C are observed, as shown in Figure 8.…”

Section: Resultsmentioning

confidence: 99%

Low cycle fatigue behaviour of 15-15Ti at 20 and 550°C under vacuum

Chen

Zhai

et al. 2019

Materials Science and Technology

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15-15Ti is one of the potential candidate materials for fuel rod cladding of lead-based reactors, and its fatigue properties have been investigated. Low cycle fatigue (LCF) tests of 15-15Ti have been carried out under total strain amplitudes ranging from ±0.3% to ±0.9% at 20 and 550°C in vacuum. The results show the LCF life decreases with the increase of temperature. Crack propagates more tortuously and the fatigue crack propagation (FCP) rate is lower when it is tested at 20°C compared to 550°C. In addition, the effect of twin boundaries (TBs) and stacking fault energy (SFE) on FCP rate is discussed in this paper.

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“…The strain rate was set to be approximately 1 × 10 −5 s −1 to avoid twin formation. Twinning deformation easily occurs at a strain rate of 1 × 10 −3 s −1 [16,17] and is suppressed at a strain rate of 1 × 10 −4 s −1 or lower [15,18]. The rectangular samples were deformed by compression at room temperature up to 10%.…”

Section: Methodsmentioning

confidence: 99%

High-Density Well-Aligned Dislocations Introduced by Plastic Deformation in Bi1−xSbx Topological Insulator Single Crystals

2019

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Topological insulators (TIs) have a bulk bandgap and gapless edge or surface states that host helically spin-polarized Dirac fermions. Theoretically, it has been predicted that gapless states could also be formed along dislocations in TIs. Recently, conductivity measurements on plastically deformed bismuth antimony (Bi1−xSbx) TIs have revealed excess conductivity owing to dislocation conduction. For further application of them, fundamental study on dislocations in TIs is indispensable. Dislocations controlled based on fundamental studies could potentially be useful not only for experimental investigations of the dislocation properties but also for diverse device applications. In the present study, Bi1−xSbx TI single crystals were fabricated by a zone-melting method. The crystals were plastically deformed at room temperature. The resultant dislocations were observed by transmission electron microscopy (TEM). It was found that high-density dislocations with the Burgers vector satisfying the condition for the formation of gapless states were successfully introduced. The dislocations were mostly of edge type with lengths on the order of more than a few micrometers.

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Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Cited by 8 publications

References 25 publications

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

Effect of Bi Addition on Tensile Properties of Sn–Ag–Cu Solder at Low Temperature

Low cycle fatigue behaviour of 15-15Ti at 20 and 550°C under vacuum

High-Density Well-Aligned Dislocations Introduced by Plastic Deformation in Bi1−xSbx Topological Insulator Single Crystals

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