2024 IEEE 4th International Conference on Power, Electronics and Computer Applications (ICPECA) 2024
DOI: 10.1109/icpeca60615.2024.10471161
|View full text |Cite
|
Sign up to set email alerts
|

Influence of Temperature and Humidity on IGBT Module Internal Stress

Jinyan Li,
Mingchao Zhou,
Yanbei Sha
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 7 publications
0
1
0
Order By: Relevance
“…In 2022, a transfer function to model the humidity in a power module was recently suggested by [4]. Lately, [15] demonstrated a multi-physics coupling model to develop a multi-physical field coupling model that integrates electrical, thermal, and mechanical aspects of an IGBT module. Simulation-based analysis are indispensable for assessing system reliability.…”
Section: Introductionmentioning
confidence: 99%
“…In 2022, a transfer function to model the humidity in a power module was recently suggested by [4]. Lately, [15] demonstrated a multi-physics coupling model to develop a multi-physical field coupling model that integrates electrical, thermal, and mechanical aspects of an IGBT module. Simulation-based analysis are indispensable for assessing system reliability.…”
Section: Introductionmentioning
confidence: 99%