Influence of Surface Preparation on the Interface of Al-Cu Joints Produced by Magnetic Pulse Welding

Abstract

Magnetic pulse welding can be considered as an advanced joining technique because it does not require any shielding atmosphere and input heat similar to conventional welding techniques. However, it requires comprehensive evaluations for bonding dissimilar materials. In addition to processing parameters, the surface preparation of the components, such as target material, needs to be evaluated. Different surface conditions were tested (machined, sand-blasted, polished, lubricated, chemically attacked, and threaded) using a fixed gap and standoff distance for welding. Microstructural observations and tensile testing revealed that the weld quality is dependent on surface preparation. The formation of waviness microstructure and intermetallic compounds were verified at the interface of some joints. However, these conditions did not guarantee the strength.

The Energy Balance in Aluminum–Copper High-Speed Collision Welding

“…However, previous studies revealed that the CoP, which is pushed ahead in the joining gap by the collision front, may prevent bond formation at small collision angles. In fact, the high roughness of the colliding surfaces can cause the CoP to be trapped by the collision front, inhibiting the particles from contacting the virgin base material [21,30,32]. However, since the EDX analysis did not detect any oxides, this is not the reason in the present study.…”

Impact Welding of Materials

“…A study focused on magnetic pulse welding was conducted by Emadinia et al [9]. These authors studied the influence of the surface preparation on the interface properties of aluminium/copper tubular joints.…”

Adhesion of thin metallic layers on Au surfaces

“…Learning to control the stability of metallic interfaces is important for a number of applications in industry, including transistors, catalysis and reflectors, as well as for the development of solders, heat-dissipation problems in electronic devices, friction, lubrication, manipulation of material properties, plasmonics and mirrors [1][2][3][4][5][6][7][8][9][10][11]. Various physical factors need to be taken into account, such as the orientation of the crystal structure, magnetism, electronic, mechanical and thermodynamic properties [12][13][14][15][16][17][18][19][20].…”