Influence of surface preheating and pretreatment on the adhesion of laser-melted PEEK to aluminum substrates

Dahmen, Marius; Vedder, Christian; Speckens, Marcel; Stollenwerk, Jochen; Loosen, Peter

doi:10.1016/j.surfcoat.2022.128922

Cited by 2 publications

(2 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since the substrate surface is roughened by sandblasting, the mechanical interlocking between the DIL and the substrate is a significant factor for the adhesion. The increased bond strength caused by a substrate heating is in accordance with previous studies in literature [26], [27]. Due to the improved wetting at elevated substrate temperatures, a large active area for intermolecular interaction and hence a higher strength is ensured [27].…”

Section: Characterization Of the Generated Structuressupporting

confidence: 90%

See 1 more Smart Citation

Feasibility of Manufacturing Dielectric Image Lines by Using Laser-Based Directed Energy Deposition of Polymers

Wittmann,

Bader,

Chamandani

et al. 2023

IEEE Access

View full text Add to dashboard Cite

The laser-based directed energy deposition of polymers (DED-LB/P) is an additive manufacturing process which offers the possibility to build up 3D structures with a high level of individualization on free-form surfaces. In this article, an absorber free DED-LB/P process with a thulium-doped fiber laser is presented for the first time to produce dielectric image lines (DIL) consisting of polypropylene (PP) for high frequency applications. This type of transmission line has advantages over the commonly used stripline technology due to its low signal attenuation, especially at high frequencies, but is currently hardly found in mass-market applications because no suitable manufacturing technology has been established for it yet. The steadily increasing demand of higher bandwidth in telecommunication or increased resolution of radar sensors leads to higher application frequencies and alternative interconnect technologies will become more important as they significantly define the achievable overall system performance. Based on the fabricated low-loss DILs in this study, DED-LB/P could represent such an alternative manufacturing process for future RF-applications.

show abstract

Section: Characterization Of the Generated Structuressupporting

confidence: 90%

“…The increased bond strength caused by a substrate heating is in accordance with previous studies in literature [26], [27]. Due to the improved wetting at elevated substrate temperatures, a large active area for intermolecular interaction and hence a higher strength is ensured [27].…”

Section: Characterization Of the Generated Structuressupporting

confidence: 90%