2018
DOI: 10.18502/keg.v3i5.2682
|View full text |Cite
|
Sign up to set email alerts
|

Influence of Silicon on Thermal Conductivity at Room Temperature of Al–Si–Fe Alloys

Abstract: .

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2020
2020

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 3 publications
0
1
0
Order By: Relevance
“…Indeed, for the E-C coupling, the HV values confirmed the results of the tests conducted on the other two combinations and the E-C frame case studied. In particular, it was confirmed that the extruded component (Si~1%) better conducted the heat produced during welding, resulting in a reduced change in hardness [58][59][60]. Looking at the hardness profiles, considerations similar to E-E and E-C can be advanced for extrusion-welding and casting-welding interfaces, respectively.…”
Section: Bar Samplesmentioning
confidence: 99%
“…Indeed, for the E-C coupling, the HV values confirmed the results of the tests conducted on the other two combinations and the E-C frame case studied. In particular, it was confirmed that the extruded component (Si~1%) better conducted the heat produced during welding, resulting in a reduced change in hardness [58][59][60]. Looking at the hardness profiles, considerations similar to E-E and E-C can be advanced for extrusion-welding and casting-welding interfaces, respectively.…”
Section: Bar Samplesmentioning
confidence: 99%