Influence of S-dodecylmercaptobenzimidazole as organic additive on electrodeposition of tin

Bakkali, S.; Touir, R.; Cherkaoui, Mohammed; Touhami, M. Ebn

doi:10.1016/j.surfcoat.2014.11.003

Cited by 16 publications

(12 citation statements)

References 26 publications

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“…For a constant applied current intensity, the addition of NS additive moved the cathodic reduction potential of the system. This is one of the most interesting, because most deposits are made in galvanostatic mode and the introduction of such an overvoltage may contribute to achieving codeposition with an element having a potential of more cathodic reduction [22].…”

Section: Galvanostatic Polarizationmentioning

confidence: 99%

“…This lack of sprouting loop shows that the metal deposition does not occur by a three-dimensional germination (3D). The return curve is also marked by a cathodic-anodic current transition characterizing rapid dissolution of the deposit [22].…”

Section: Linear Sweep Voltammetry and Cyclic Voltammetrymentioning

confidence: 99%

“…Scanning return is comparable to that obtained without additive, but with a lower current. While tin only has the characteristics of rapid dissolution, tin in the presence of NS additive is more akin to a slow dissolution system indicating that the additive plays a role of corrosion inhibitor [22].…”

Section: Linear Sweep Voltammetry and Cyclic Voltammetrymentioning

confidence: 99%

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Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Benabida¹,

Cherkaoui²

2017

Eurasian J Anal Chem

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Experimental investigations have been performed, using cyclic and linear sweep Voltammetry, to determine the effects of Nigella sativa essential oil additive (NS) on the electrodeposition of tin on mild steel in acid sulfuric solution. The experiments were performed under different plating time, different current densities, pH and temperature conditions. Tin electrodeposition on mild steel was performed using a DC -supply at denoted operating parameters. The presence of the NS additive caused an increase of the activation energy and of the overvoltage of the reduction of hydrogen and stannous ions. The surface of the plated steel was examined using Scanning electron microscope. Different surface characteristics were obtained depending upon the presence or free-additive. The electrodeposition rate of the plated surface was also determined by a gravimetric technique. The quality of the electro-deposition of tin, in the presence of Nigella sativa, was good as indicated by the microstructural morphology of the plated surface except for the few porosities demonstrated.

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Section: Galvanostatic Polarizationmentioning

confidence: 99%

Section: Linear Sweep Voltammetry and Cyclic Voltammetrymentioning

confidence: 99%

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Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Benabida¹,

Cherkaoui²

2017

Eurasian J Anal Chem

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“…The electrode was weighed before and after the realization of the deposit. The electrodeposition rate was calculated from the Weight-gain by the formula below 12 .…”

Section: Gravimetric Measurementsmentioning

confidence: 99%

“…This result was obtained with others additives 13,16 . This is caused by the adsorption of the additive on the working electrode surface [12][13][14][15][16] , which impeded the charge transfer 17,18 . To prevent the oxidation of the working electrode during cyclic voltammetry measurements, iron was replaced by copper working electrode.…”

Section: Chronopotentiometric Measurementsmentioning

confidence: 99%

Tin electrodeposition from sulfate solution containing a benzimidazolone derivative

2016

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Tin electrodeposition in an acidic medium in the presence of N,N’-1,3-bis-[N-3-(6-deoxy-3-O-methylD-glucopyranose-6-yl)-2-oxobenzimidazol-1-yl)]-2-tetradecyloxypropane as an additive was investigated in this work. The adequate current density and the appropriate additive concentration were determined by gravimetric measurements. Chronopotentiometric curves showed that the presence of the additive caused an increase in the overpotential of tin reduction. The investigations by cyclic voltammetry technique revealed that, in the presence and in absence of the additive, there were two peaks, one in the cathodic side attributed to the reduction of Sn2+ and the other one in the anodic side assigned to the oxidation of tin previously formed during the cathodic scan. The surface morphology of the tin deposits was studied by scanning electron microscopy (SEM) and XRD.

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The Effect of Naphthalene‐Based Additives on the Kinetics of Tin Electrodeposition on Boron‐Doped Diamond Electrodes

2021

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The effect of naphthalene-based additives: naphthalene (NPT), naphthalenesulfonate (NPTS) and hydroxynaphthalenesulfonate (HNPTS) on the kinetics of tin electrodeposition on a borondoped diamond (BDD) electrode has been studied by means of chronoamperometry and scanning electron microscopy (SEM). Potentiostatic current transients in the absence and the presence of naphthalene-based additives are analyzed by using the Scharifker-Hills model. A strong decrease of the kinetics of tin nucleation on BDD was observed in the presence of naphthalene-based additives, NPT showing the smallest effect and HNPTS showing the largest effect. From the long-term Cottrell behavior of the transients, similar values of tin(II) diffusion coefficients were obtained for all additives, suggesting that there is no complexation of Sn(II) by the additives and that the charge-transfer kinetics itself is not substantially influenced by the presence of the additives. In the absence of additives, tin deposition on BDD displays a progressive nucleation and growth mechanism at the least negative potentials, switching to instantaneous nucleation and growth at more negative potential. In the presence of NPTS and HNPTS, progressive nucleation and growth transients are observed. The growth mode results are confirmed by the tin features observed in the scanning electron micrographs. In conclusion, NPT, NPTS and HNPTS mainly decrease the rate of the nucleation of tin deposition, most likely by blocking or reducing access to active nucleation sites. In comparison, ethoxylated α-napthalenesulfonic acid (ENSA, a commonly used additive in the tin plating industry) inhibits tin deposition process on BDD even more strongly. These observations show a striking similarity to our previous study of tin deposition on gold electrodes.

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Influence of S-dodecylmercaptobenzimidazole as organic additive on electrodeposition of tin

Cited by 16 publications

References 26 publications

Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Tin electrodeposition from sulfate solution containing a benzimidazolone derivative

The Effect of Naphthalene‐Based Additives on the Kinetics of Tin Electrodeposition on Boron‐Doped Diamond Electrodes

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