Influence of Pulse Energy and Defocus Amount on the Mechanism and Surface Characteristics of Femtosecond Laser Polishing of SiC Ceramics

Zhang, Xuanhua; Chen, Xiaoxiao; Chen, Tao; Ma, Guang‐Lei; Zhang, Wenwu; Huang, Lirong

doi:10.3390/mi13071118

Cited by 14 publications

(7 citation statements)

References 32 publications

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“…When the nanosecond laser acts on the surface of the material, the high temperature triggers a series of chemical reactions, such as the formation of oxides, and finally, leads to the removal of CMC-SiCf/SiC under the influence of various physical and chemical factors. In the process of nanosecond laser grooving, there is an oxidation phenomenon, and the white solid particles produced are SiO 2 [ 27 ].…”

Section: Resultsmentioning

confidence: 99%

Study on the Grooved Morphology of CMC-SiCf/SiC by Dual-Beam Coupling Nanosecond Laser

Chen

Zhang

et al. 2022

Materials

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Due to the excellent properties of high hardness, oxidation resistance, and high-temperature resistance, silicon carbide fiber reinforced silicon carbide ceramic matrix composite (CMC-SiCf/SiC) is a typical difficult-to-process material. In this paper, according to the relationship between the spatial posture of dual beams and the direction of the machining path, two kinds of scanning methods were set up. The CMC-SiCf/SiC grooving experiments were carried out along different feeding directions (transverse scanning and longitudinal scanning) by using a novel dual-beam coupling nanosecond laser, and the characteristics of grooving morphology were observed by Laser Confocal Microscope, Scanning Electron Microscopy (SEM), and Energy Dispersive Spectrometer (EDS). The results show that the transverse scanning grooving section morphology is V shape, and the longitudinal scanning groove section morphology is W shape. The grooving surface depth and width of transverse scanning are larger and smaller than that of longitudinal scanning when the laser parameters are the same. The depth of the transverse grooving is greater than that of the longitudinal grooving when the laser beam is transverse and longitudinal scanning, the maximum grooving depth is approximately 145.39 μm when the laser energy density is 76.73 J/cm2, and the minimum grooving depth is approximately 83.76 μm when the laser energy density is about 29.59 J/cm2. The thermal conductivity of fiber has a significant effect on the local characteristics of the grooved morphology when using a medium energy density grooving. The obvious recasting layer is produced after the laser is applied to CMC-SiCf/SiC when using a high energy density laser grooving, which directly affects the grooved morphology.

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Section: Resultsmentioning

confidence: 99%

Study on the Grooved Morphology of CMC-SiCf/SiC by Dual-Beam Coupling Nanosecond Laser

Chen

Zhang

et al. 2022

Materials

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“…Because of the longer duration of larger molten pool, if the laser frequency is further increased until the pulse interval is less than molten pool duration, the continuous melting process will become a quasicontinuous melting process [205]. Laser diameter decreases with the increase of defocus amount [203,235,236]. When focus energy intensity is too much, a certain amount of defocusing will greatly help to reduce the surface roughness.…”

Section: Machining Characteristics Of Lmpmentioning

confidence: 99%

Field-assisted machining of difficult-to-machine materials

Zhang,

Zheng,

Huang

et al. 2024

Int. J. Extrem. Manuf.

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Difficult-to-machine materials (DMMs) are extensively applied in critical fields such as aviation, national defense, biomedicine, and other key fields due to their excellent material properties. However, traditional machining technology is difficult to precisely machine DMMs due to poor surface quality and low processing efficiency. In recent years, as a new generation of machining technology, field-assisted machining (FAM) technology based on innovative principles such as laser heating, tool vibration, magnetic magnetization, and plasma modification provides a new solution for improving the machinability of DMMs. It is advantageous to prevent the shortcomings of traditional machining methods, and has become a hot topic of research in the domain of ultra-precision machining of DMMs. Many new methods and principles have been presented and investigated one after another, yet few researches have been analysed and summarized from a comprehensive standpoint. To fill this gap and understand the development trend of FAM, this study provides an important overview of FAM, covering different assisted machining methods, application effects, mechanism analysis, and equipment design. The current deficiencies and future challenges of FAM are summarized to lay the foundation for the further development of multi-field hybrid assisted and intelligent field-assisted machining technologies.

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“…Laser ablation threshold refers to the minimum laser energy density required to achieve material removal using a laser 8 .…”

Section: Calculation and Analysis Of Laser Single Pulse Ablation Thre...mentioning

confidence: 99%

“…The microcrack is mainly caused by the thermal stress. Zhang et al 8 used femtosecond laser to ablate and polish SiC ceramic. The results show that the laser ablation threshold of SiC ceramics is 0.355 J / cm 2 under specific experimental parameters.…”

Section: Introductionmentioning

confidence: 99%

Study on the single pulse ablation characteristics of SiC ceramics by infrared femtosecond laser

Shen,

Chen,

Zhang

et al. 2023

Eighteenth National Conference on Laser Technology and Optoelectronics

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SiC ceramics have excellent physical and chemical properties, and have been extensively researched and used in electronics, optics, semiconductor and other fields. However, due to its high strength, high hardness and other characteristics, the conventional processing of SiC ceramics faces a series of challenges. Laser processing has become an effective processing technology due to its unique advantages. In this paper, the single pulse ablation tests of SiC ceramic with different powers were performed by using infrared femtosecond laser. The single pulse ablation threshold of SiC ceramic was calculated by using equivalent diameter method and equivalent area method, and the influence of laser power on the depth of the ablation hole was discussed. The results show that when the repetition frequency is 25kHz and the wavelength is 1035nm, the laser ablation values calculated by the equivalent diameter method and the equivalent area method are 0.3454 J/cm2 and 0.3268 J/cm2, respectively. Within a certain laser power range or reaching a certain ablation hole depth, the ablation hole depth augments with the increment of laser power. Beyond a specified laser power range, the hole depth decreases with the increment of laser power due to the effect of plasma shielding and recasting layer.

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Influence of Pulse Energy and Defocus Amount on the Mechanism and Surface Characteristics of Femtosecond Laser Polishing of SiC Ceramics

Cited by 14 publications

References 32 publications

Study on the Grooved Morphology of CMC-SiCf/SiC by Dual-Beam Coupling Nanosecond Laser

Study on the Grooved Morphology of CMC-SiCf/SiC by Dual-Beam Coupling Nanosecond Laser

Field-assisted machining of difficult-to-machine materials

Study on the single pulse ablation characteristics of SiC ceramics by infrared femtosecond laser

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