Abstract:The influence of the pre-existing void in the Cu/Sn58Bi/Cu solder joint on electromigration behavior was investigated by in-situ SEM observation and focused ion beam (FIB) analysis. The results show that the void with smooth internal surface has no influence on the Bi atom migration, while the one with a sharp notch may easily result in Bi atom congregation and further lead to the formation of cracks there, indicating that the void with a sharp notch can deteriorate the reliability of the solder joint undergoi… Show more
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