2016
DOI: 10.1016/j.jallcom.2016.05.340
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Influence of powder size on thermoelectric properties of p-type 25%Bi2Te375%Sb2Te3 alloys fabricated using gas-atomization and spark-plasma sintering

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Cited by 50 publications
(28 citation statements)
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“…The mechanical strength of thermoelectric materials is important for preparation TE modules. The maximum Vickers hardness of 102 Hv was obtained for the EG-pH10 sintered sample, which is significantly higher or comparable to several reported results [14,20]. The obtained high hardness in the bulk sample was due to the presence of fine grains and increased amount of grain boundaries [20].…”
Section: Resultssupporting
confidence: 85%
“…The mechanical strength of thermoelectric materials is important for preparation TE modules. The maximum Vickers hardness of 102 Hv was obtained for the EG-pH10 sintered sample, which is significantly higher or comparable to several reported results [14,20]. The obtained high hardness in the bulk sample was due to the presence of fine grains and increased amount of grain boundaries [20].…”
Section: Resultssupporting
confidence: 85%
“…In this report, the grain size increased with increasing powder size and, as a result, electrical conductivity was increased, due to increasing carrier mobility values. We obtained a maximum ZT of 1.2 with a 32-75 µm specimen due to the high power factor and reasonable thermal conductivity [20]. However, it is necessary to maintain an inert atmosphere in the gas atomization process, and the use of nitrogen and argon gasses is expensive.…”
Section: Introductionmentioning
confidence: 99%
“…Considering the difference of T m , T g ( Figure a) and thermal expansion coefficients (TEC) (Figure b) among materials as well as the construction of fiber preform (see the Supporting Information for details), we categorize typical functional materials in three distinct groups: high temperature group (cladding: silica; core: Si, Ge, Au, and Cu), medium temperature group (cladding: borosilicate; core: Bi 2 Te 3 ), and low temperature group (cladding: polymer; core: Se and chalcogenide glass). These fiber core materials cover most commonly used materials in photonics, electronics, optoelectronics, and thermoelectronics . Note the drawing temperatures of these groups range from 400 to 2400 K, and the viscosity ratios between the fiber core and fiber cladding vary from 10 −3 to 10 −12 .…”
Section: Resultsmentioning
confidence: 99%