Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints

Hanim, M. A. Azmah; Dasan, Anusha Baradi; Dele‐Afolabi, T.T.; Ariga, Tadashi; Vidyatharran, K.

doi:10.1007/s10854-020-05194-6

Cited by 11 publications

(3 citation statements)

References 32 publications

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“…Meanwhile, lead-free solder composites such as tinsilver-copper solder incorporated with carbon nanotubes or graphene nanotubes have been able to pro-vide performance and quality that are crucial to the integrity of a solder joint [8]. Studies have shown that the addition of carbon nanotubes (CNTs) into lead-free solder systems provided superior performance in refining the microstructure, lowering the intermetallic growth rate as well as enhancing shear strength and the hardness [9][10][11][12][13][14]. Hence, introducing suitable reinforcement particles into a solder matrix is crucial in producing a solder system that can have optimal performance under extreme service conditions and can function decently in densely packed electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

Hanim

Wei

Dele‐Afolabi

et al. 2021

Materialwissenschaft Werkst

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In this study, the mechanical performance of the rice husk ash-reinforced tin-0.7 copper composite solder was investigated. 0.01 wt.%, 0.05 wt.% and 0.1 wt.% of rice husk ash (RHA) were added to the solder matrix to prepare the composite solders. In order, to replace the costly electroless nickel immersion gold surface finish on the copper substrate, the effect of electroless nickel immersion silver (ENIAg) as the surface finish was studied. The differential scanning calorimetry (DSC) analysis showed that the composite solder exhibited lower melting temperature relative to the plain solder owing to the inclusion of rice husk ash. Shear strength analysis was carried out to investigate the influence of rice husk ash and electroless nickel immersion silver surface finish on the shear strength of the developed composite solders. The results proved that the rice husk ash failed to enhance the shear strength of tin-0.7 copper lead-free solder with the plain solder exhibiting the highest shear strength.Keywords: Lead free solder / rice husk ash / tin-copper / electroless nickel / immersion silver / microstructure / mechanical properties Schlüsselwörter: Bleifreier Lotwerkstoff / Reisschalenasche / Zinn-Kupfer / chemisch Nickel / chemisch Silber / Gefüge / mechanische Eigenschaften

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Section: Introductionmentioning

confidence: 99%

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

Hanim

Wei

Dele‐Afolabi

et al. 2021

Materialwissenschaft Werkst

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“…are relatively brittle and can quickly become fracture sites, seriously affecting the reliability of solder joints[76].Crystals 2023, 13, x FOR PEER REVIEW 10 of 20 composite solders because IMCs are relatively brittle and can quickly become fracture sites, seriously affecting the reliability of solder joints[76].…”

mentioning

confidence: 99%

“…13, x FOR PEER REVIEW 10 of 20 composite solders because IMCs are relatively brittle and can quickly become fracture sites, seriously affecting the reliability of solder joints[76].…”

mentioning

confidence: 99%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

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Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of CNTs, introduces the preparation methods of CNT composite solders, and focuses on the review of tin-based lead-free solders reinforced with unmodified CNTs and metal-modified CNTs. The addition of CNTs can effectively improve the ultimate tensile strength, microhardness, shear strength, and creep resistance of the solder. However, the practical application of CNT composite solders has been a challenge for researchers for decades. The most significant issue is uniform dispersion due to the large density and surface differences between CNTs and solders. Other concerns are the structural integrity of CNTs and their limited addition amount, solder wettability, and interfacial bonding. CNT composite solders can only be widely used in a real sense when these challenges are properly addressed and overcome. At present, there is a lack of comprehensive reviews covering the structure, the strengthening mechanism, the preparation method of CNT composite solders, and the influence of CNT types on their strengthening effects. Therefore, this paper aims to fill this gap and contribute to solving the problems faced by the application of CNTs in solder. Future work is expected to focus on improving the dispersion and bonding of CNTs and optimizing the preparation method.

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Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components

Hanim

Dele‐Afolabi

2023

Springer Proceedings in Physics

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Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints

Cited by 11 publications

References 32 publications

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Materials Modification of Lead-Free Solder Alloys with Different Reinforcing Components

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