Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Liu, Y.; Wang, J.; Yin, Liang; Kondos, P.; Parks, C.; Børgesen, Peter; Henderson, D. W.; Cotts, E. J.; Dimitrov, Nikolay

doi:10.1007/s10800-008-9618-z

Cited by 82 publications

(107 citation statements)

References 24 publications

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“…Dimitrov's group [16,17,[33][34][35] also studied the impurity effect since 2008 by using various additive combinations including PEG, SPS, and Cl − . The individual use of PEG or Cl − resulted in a lower overpotential in the electrodeposition of Cu, but the use of PEG + Cl − (nominated as PC) caused an increment in the overpotential, showing that PEG is a suppressor and needs to co-work with the Cl − ions.…”

Section: Effects Of Impurity On Interfacial Reactions Of Electroplatementioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

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Copper (Cu) electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG) and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl) disulfide (SPS) with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

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Section: Effects Of Impurity On Interfacial Reactions Of Electroplatementioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

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“…PEG ? Cl -, an increase in the SPS in the deposit was registered in the range 0.5-5.0 mA cm -2 [13,14]. Accordingly, higher voiding propensity was found in Cu deposits with a higher impurity level.…”

Section: Introductionmentioning

confidence: 97%

“…To assess the quality of electroplating to the voiding propensity, studies reported by our research group have shown that voiding in the IMC Cu 3 Sn can be ''turned on'' and ''turned off'' by monitoring the factors that govern the electrodeposition of Cu from the acidic copper sulfate solution that are largely responsible for the impurity incorporation termed to be the primary cause to void evolution in the IMC [13][14][15]. The impurities associated with voiding came from the additives used in the Cu electrodeposition [13,14], i.e., polyethylene glycol (PEG), SPS, and the chloride ions (Cl -) that are indispensable in today's industrial acid Cu electroplating solution [6,16,17].…”

Section: Introductionmentioning

confidence: 99%

“…The impurities associated with voiding came from the additives used in the Cu electrodeposition [13,14], i.e., polyethylene glycol (PEG), SPS, and the chloride ions (Cl -) that are indispensable in today's industrial acid Cu electroplating solution [6,16,17]. The effect of solution composition, deposition rate, deposition potential, solution temperature, and solution aging on the voiding propensity in the Cu solder joint have been investigated [14,15].…”

Section: Introductionmentioning

confidence: 99%

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Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

et al. 2011

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A quantitative study of the impact of key Cu plating parameters on the voiding propensity of solder joints with Cu electroplated in a commercially available plating solution (CAPS) is performed first on 0.3 cm 2 Cu rotating disk electrode. It is shown that similar to samples plated in a generic plating solution (GPS) containing bis(3-sulfopropyl) disulfide, polyethylene glycol, and Cl -ions, void-prone samples are deposited predominantly at higher overpotentials, in the range from positive to -0.20 V. In the second part, a Hull cell with 46 cm 2 cathode is used to scale up the voiding study in both, GPS and CAPS. It is demonstrated that plating conditions could be chosen in a way to generate both, void-prone and void-proof Cu on the same cathode panel. Thus, the controlled voiding propensity illustrated for the first time in a prototype of industrial Cu plating helps in realizing the sporadic nature of the voiding phenomenon.

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“…In case of Cu-solder reaction, many studies have reported that Cu plating conditions such as additives are related to microvoid formation at the CuCu 3 Sn interface, affecting the final solder joint reliability. [13][14][15][16][17] In case of Ni-solder reaction, it is reported that the Ni-P plating bath life affects the brittle fracture behavior of Sn-Ag-Cu solder joints. 18 However, few studies have investigated the effect of Ni-P plating conditions on solder joint properties.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Seo

Kim

et al. 2017

Journal of Elec Materi

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The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures from 75°C to 85°C and fixed pH of 4.5. SAC305 solder balls with diameter of 450 lm were mounted on the prepared ENIG-finished Cu pads and reflowed with peak temperature of 250°C. The interfacial intermetallic compound (IMC) thickness after reflow decreased with increasing Ni-P plating temperature. After 800 h of thermal aging, the IMC thickness of the sample prepared at 85°C was higher than for that prepared at 75°C. Scanning electron microscopy of the Ni-P surface after removal of the Au layer revealed a nodular structure on the Ni-P surface. The nodule size of the Ni-P decreased with increasing Ni-P plating temperature. The Cu content near the IMC layer increased to 0.6 wt.%, higher than the original Cu content of 0.5 wt.%, indicating that Cu diffused from the Cu pad to the solder ball through the Ni-P layer at a rate depending on the nodule size. The sample prepared at 75°C with thicker interfacial IMC showed greater high-speed shear strength than the sample prepared at 85°C. Brittle fracture increased with decreasing Ni-P plating temperature.

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Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Cited by 82 publications

References 24 publications

Impurity Effects in Electroplated-Copper Solder Joints

Impurity Effects in Electroplated-Copper Solder Joints

Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

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