Influence of PCB Surface Finish and Thermal and Temperature/Humidity Aging on the Performance of a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly

Ramkumar, S. Manian; Srihari, K.

doi:10.1109/ectc.2007.373778

Cited by 10 publications

(3 citation statements)

References 13 publications

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“…129 Different surface finishes result in a wide range of surface roughness of the electrodes, for example as low as a few nm in the electrodeposited Sn method 130 and as high as a few hundred nm in the immersion Sn. 131 Surface roughness of electrodes affects the electrolyte formation step. 17,132,133 A rougher surface contains more localized regions for water adsorption, for example, pores, pits, and scratches.…”

Section: Surface Conditionsmentioning

confidence: 99%

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Lee

Goh

Haseeb

et al. 2023

J. Electrochem. Soc.

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Electrochemical migration (ECM) is one of the serious failure modes encountered in electronic devices due to the electrochemical reactions triggered by the presence of moisture and bias voltage, leading to the growth of dendrites and short circuits. The classical ECM mechanism consists of four consecutive stages: (i) electrolyte formation, (ii) anodic dissolution, (iii) ion transport, and (iv) dendrite growth. ECM is a delicate process that involves a combination of a good number of factors, such as the electrode properties, climatic conditions, contaminants, electric field, additives, etc. We intend to provide a comprehensive review of the complex effects that these factors have on each stage of ECM and provide insights into the recent developments in ECM research. Previous findings, current debates and recent discoveries are covered in this article. This review paper also provides a review of recent strategies for ameliorating ECM failures in electronics.

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Section: Surface Conditionsmentioning

confidence: 99%

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Lee

Goh

Haseeb

et al. 2023

J. Electrochem. Soc.

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“…Indirectly, the polished surface minimizes air gaps and increases the contact surface area as the purpose of thermal paste as thermal interface material. From Table I, it is observed that the R thJA value reduced by 0.63 K/W for polished surface with thermal paste condition (Ramkumar and Srihari, 2007). From these observations, noticeable reduction in R thJA value could be observed for thermal paste condition on polished surface than the rough surface.…”

Section: Thermal Transient Analysismentioning

confidence: 72%

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

Shanmugan

Nadarajah

Devarajan

2013

Microelectronics International

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Purpose -Surface configuration at the interface between two materials makes a huge difference on thermal resistance. Thermal transient analysis is a powerful tool for thermal characterization of complex structures like LEDs. The purpose of this paper is to report the influence of surface finish on thermal resistance. Design/methodology/approach -Surface of heat sink was modified into two categories: machined as channel like structure; and polished using mechanical polisher and tested with 3W green LED for thermal resistance analysis. Findings -The observed surface roughness of rough and polished surface was 44 nm and 4 nm, respectively. Structure function analysis was used to determine the thermal resistance between heat sink and MCPCB board. The observed thermal resistance from junction to ambient (R thJA ) value measured with thermal paste at 700 mA was lower (34.85 K/W) for channel like surface than rough surface (36.5 K/W). The calculated junction temperature (T J ) for channel like surface and polished surface was 81.298C and 85.248C, respectively. Research limitations/implications -Channelled surface aids in increasing bond line thickness. Surface polishing helps to reduce the air gaps between MCPCB and heat sink and also to increase the surface contact conductance. Practical implications -The proposed method of surface modification can be easily done at laboratory level with locally available techniques. Originality/value -Much of the available literature is only concentrating on the design modification and heat transfer from fins to ambient. There was little research on modification of top surface of the heat sink and the proposed concept would give good results and also it will make the material cost reduction as well as material too.

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“…A conventional way of evaluating the robustness of this type of interconnects is e.g. by an accelerated humidity test at 85°C/85%RH for 500 to 2000 hours [1,2,3,4,5,6]. The long test duration, however, determines to a large extend the throughput time for new developments.…”

Section: Introductionmentioning

confidence: 99%

HART: A new highly accelerated robustness test for conductive adhesive interconnects

Caers

Zhao

Vries

et al. 2008

2008 58th Electronic Components and Technology Conference

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The Highly Accelerated Robustness Test, HART, is an approach that allows the assessment or the robustness of adhesive interconnects at a throughput rate that is 10 times faster than the conventional accelerated humidity test, without going to higher stress levels. The test is based on the physics of a conductive adhesive interconnect. In stead of using the contact resistance drift over time in a static temperaturehumidity environment, HART uses the effect of a changing temperature or humidity environment on the contact resistance as a characteristic of the robustness of the interconnect. HART using moisture as stressor is by far the most powerful approach of the two. Both the response and hysteresis in a cyclic humidity environment are proposed as new criteria for the interconnect robustness. Flip chip on flex interconnections with conductive and non-conductive adhesives are used as a carrier. Different contact material combinations and different adhesives are used in this study.

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Influence of PCB Surface Finish and Thermal and Temperature/Humidity Aging on the Performance of a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly

Cited by 10 publications

References 13 publications

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

HART: A new highly accelerated robustness test for conductive adhesive interconnects

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