Influence of particle size on densification and abnormal expansion of LTCC multilayer substrate

Abstract

I. Ogura (2002) Influence of particle size on densification and abnormal expansion of LTCC multilayer substrate, British denoted series S, and the remainder to fabricate samples denoted series L. T wo series of LT CC ( low temperature co red ceramic) F igure 1 shows a owchart for the fabrication process of multilayer substrates were fabricated using glass the LTCC multilayer samples. Glass powder was mixed powders with diVerent particle sizes. T he series with with commercial Al 2 O 3 to form a glass-ceramic system ner particle size always showed better densi cation containing 60 wt-% glass and 40 wt-% Al 2 O 3 . A slurry was properties. A bnormal ex pansion was found in the formed by mixing the glass-ceramic powder with binder experimental samples as a result of the emergence and (P VB), solvent (toluene), and plasticiser (D BP ). The slurry growth of a second crystalline phase, Al 3Siwas ground in a ball mill and spread onto polyphenylene BCT /502 sulphide lm using the doctor blade casting method, to form green sheets 70-250 mm thick.

Influence of Nature of Filler on Densification of Anorthite‐Based Crystallizable Glass+Ceramic System for Low Temperature Cofired Ceramics Application

“…Identification of suitable ceramic fillers for glass+ceramic composition is equally important because they determine the densification behavior and final physical properties of the substrate 20,25,26 . Type and nature of the filler material especially the particle size and wettability with glass as well as its volume fraction can influence the densification behavior 27–29 . The filler also influences the crystallization behavior of the glass 23,24 .…”

Radio Frequency Thermal Plasma Treatment for Size Reduction and Spheroidization of Glass Powders Used in Ceramic Electronic Devices

“…M icrometer ‐ sized glass powders have been widely used in many ceramic electronic devices. For example, the dielectric layer and the barrier rib in a plasma display panel (PDP) are formed by firing these powders, 1 which are also used as key sintering aids in the applications to multi‐layer ceramic capacitor (MLCC) 2 and low‐temperature cofired ceramics (LTCC) 3 . However, submicrometer‐sized glass powders of spherical shape are generally preferred for these applications because they can easily form a thinner and more homogenous dielectric layer 4 in the fabrications of the ceramic electronic devices.…”

“…However, submicrometer‐sized glass powders of spherical shape are generally preferred for these applications because they can easily form a thinner and more homogenous dielectric layer 4 in the fabrications of the ceramic electronic devices. In addition, the spherical shape of glass powders with very small diameters can reduce the porosity in the dielectric layers during the sintering process in PDP and LTCC fabrications 3,4 . But conventional breaking‐down methods, such as ball and jet mills, unfortunately have a limitation in reducing the size of the micrometer‐sized glass powders down to a submicrometer size, because their milling efficiency is extremely low when handling the micrometer‐sized powders.…”